Integrated Smart High-Voltage Relay With Gate Driver
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Solution Overview
Problem
Existing solid-state switch modules that replace contactors are often costly and complex due to the need for external driving, protection, sensing, and communication circuits, which increases space requirements and complexity.
Innovation Solution
A relay assembly that integrates driving circuits, protection circuits, sensing circuits, communication interfaces, and a power supply within a single case, including a gate driver circuit, protection circuit, sensors, and a CAN bus interface, with the gate driver circuit positioned close to the switch terminals to minimize inductance and parasitic effects, and a self-powered design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solid-state switch modules are used to replace contactors with external driving circuits, protection circuits, sensing circuits, and communication interfaces, then the switching functionality is improved, but the device complexity and cost increase
Solution Approach 1:
The patent integrates the solid-state switch module, gate driver circuit, protection circuit, sensing circuit, and communication interface into a single integrated relay assembly housed in one case. This merging of previously separate external components into a unified module reduces device complexity and cost while maintaining all necessary switching functionalities.
2Reliability
If external circuits are assembled to support the solid-state switch module, then the switching performance is improved, but the occupied volume increases
Solution Approach 1:
All supporting circuits including the gate driver, protection, sensing, and communication interfaces are integrated within the same case as the solid-state switch module, eliminating the need for separate external assemblies and reducing the total occupied volume.
Solution Approach 2:
The patent employs a nested arrangement where the gate driver circuit, protection circuit, sensing circuit, and communication interface are all housed within the case that contains the solid-state switch module, creating a compact nested structure that minimizes space requirements.
3Object-generated harmful factors
If the gate driver circuit is positioned close to the switch terminals, then the inductance is reduced, but the integration complexity increases
Solution Approach 1:
The gate driver circuit is integrated within the same case and positioned in close proximity to the switch terminals, minimizing the loop area and reducing parasitic inductance. This spatial integration achieves low inductance without requiring complex external wiring arrangements.
Data Source
AI summary
An integrated smart relay assembly includes a case and an electronic solid-state switch disposed inside the case and a gate driver circuit electrically connected to the electronic solid-state switch. The gate driver circuit is configured to drive the electronic solid-state switch with a predetermined gate voltage and a predetermined gate current. The relay assembly further includes a protection circuit electrically connected to the gate driver circuit. The protection circuit is configured to protect the electronic solid-state switch against over-voltage, short circuit, and overheating. The relay assembly further includes a communication interface integrated with the electronic solid-state switch. Each of the protection circuit, electronic solid-state switch, and the communication interface is disposed inside the case.