Smart IC Substrate Coil Layout for NFC and Card Adhesion

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing smart IC modules face issues with poor adhesion to card modules due to reduced adhesive regions caused by antenna placement and molding members, leading to deteriorated NFC characteristics and adhesion problems.

Innovation Solution

A smart IC substrate with a coil pattern on one surface and circuit patterns on the other, featuring vias and connection members that allow for indirect connections between the coil pattern and chip, ensuring the molding member does not obstruct the adhesive region, thereby enhancing adhesion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the antenna is directly disposed on the smart IC module, then the NFC function can be implemented, but the adhesive region for adhering to the card module is reduced

Engineering Contradiction:

ImproveNFC functionVSAvoidadhesive region

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The substrate is divided into a first region inside the coil pattern and a second region outside the coil pattern. The antenna is disposed only in the first region, while the second region maintains full adhesive functionality. This spatial segmentation allows both NFC function and adequate adhesive region to coexist.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the substrate are assigned different functions: the first region (inside coil) is dedicated to antenna placement for NFC functionality, while the second region (outside coil) is reserved for adhesion to the card module. This local differentiation optimizes both NFC performance and bonding strength.

Inventive Principle:

Principle #3Local quality

2Reliability

If a molding member is added to protect the connection region, then connection reliability is improved, but the adhesive region is further reduced

Engineering Contradiction:

Improveconnection reliabilityVSAvoidadhesive region

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The connection region with the molding member is nested within the first region (inside the coil pattern). This nesting arrangement ensures that the protective molding member does not encroach on the second region, thereby preserving the adhesive region while still providing necessary connection protection.

Inventive Principle:

Principle #7Nested doll (Nesting)

3Reliability

If the antenna sheet is inserted separately and connected using flip chip method, then the antenna can be electrically connected, but the adhesion between smart IC module and antenna sheet deteriorates

Engineering Contradiction:

Improveelectrical connectionVSAvoidadhesion

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The antenna (coil pattern) is integrated directly onto the smart IC module substrate rather than being a separate inserted sheet. This merging eliminates the interface between separate components, thereby improving adhesion while maintaining electrical connection reliability through the integrated structure.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution ensures secure adhesion of the smart IC module to the card module by maintaining a sufficient adhesive region, improving adhesion and preventing deterioration of NFC characteristics.

Implementation Method 1

the coil pattern is electrically connected to a first terminal and a second terminal... the coil pattern for transmitting and receiving radio frequencies

Methodology Applied

Scientific EffectElectromagnetic Induction: Electromagnetic Induction

Data Source

PatentUS12530558B2Smart IC substrate, smart IC module, and IC card including the same

Publication Date: 2026.01.20 LG INNOTEK CO LTD

AI summary

A smart IC substrate according to an embodiment includes: a substrate including one surface and the other surface; a circuit pattern and a connection circuit pattern disposed on the one surface; and a coil pattern disposed on the other surface, wherein a chip mounting region is formed on the other surface, the coil pattern is electrically connected to a first terminal and a second terminal, the substrate includes a first region disposed inside the coil pattern and a second region disposed outside the coil pattern, the first terminal is disposed in the first region, the second terminal is disposed in the second region, a first via is formed in the first region corresponding to the circuit pattern of the substrate, a second via is formed in the second region of the substrate, a third via is formed in the first region corresponding to the connection circuit pattern of the substrate, and a connection member is disposed inside the second via.