Smart IC Substrate Plating Structure for Corrosion-Resistant Bonding
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Solution Overview
Problem
Existing smart IC substrates face issues with limited material options for wires, corrosion of plating layers, and reduced electrical conductivity due to oxidation, leading to unreliable electrical connections and increased process costs.
Innovation Solution
A smart IC substrate design featuring a dual plating layer structure with a protective layer having lower reactivity than the second plating layer, allowing for the use of various materials and reducing oxidation, while maintaining electrical conductivity and rigidity, and incorporating a gold-silver alloy for improved hardness and process efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a plating layer is used for wire bonding, then electrical conductivity is achieved, but the plating layer corrodes and oxidizes during the process, reducing electrical conductivity
Solution Approach 1:
A protective layer is introduced as an intermediary between the plating layer and the external environment. This protective layer prevents direct exposure of the plating layer to oxidizing conditions during wire bonding and storage, thereby maintaining electrical conductivity without compromising the bonding function.
Solution Approach 2:
The protective layer creates an inert environment for the plating layer by preventing contact with oxygen and moisture. This inert protection eliminates oxidation and corrosion issues that would otherwise degrade the electrical conductivity of the plating layer over time.
2Reliability
If the plating layer is made more corrosion-resistant, then reliability improves, but the material options for wires become limited
Solution Approach 1:
The structure is segmented into functionally distinct layers: the plating layer provides electrical conductivity and wire bonding functionality, while the separate protective layer provides corrosion resistance. This segmentation allows each layer to be optimized independently, enabling versatile wire material choices without compromising corrosion resistance.
3Reliability
If multiple layers are added to protect against corrosion, then reliability improves, but process complexity increases
Solution Approach 1:
The protective layer serves multiple functions simultaneously: it prevents oxidation and corrosion, maintains electrical conductivity of the underlying plating layer, and provides a stable surface for wire bonding. This multi-functionality reduces the need for additional specialized layers, simplifying the overall structure despite the added protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances electrical connection reliability, maintains conductivity, reduces corrosion rates, and improves process efficiency by allowing the use of different materials and reducing separate processing steps, thereby minimizing costs.
Implementation Method 1
the second-second layer can be prevented from oxidation or discoloration
Implementation Method 2
The chip and the conductive pattern are electrically connected by wire bonding
Data Source
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AI summary
A smart IC substrate according to an embodiment includes a substrate including a first surface and a second surface opposite to the first surface; a bonding layer disposed on the first surface; a metal layer disposed on the bonding layer; a first plating layer disposed on one surface of the metal layer; and a second plating layer disposed on the other surface of the metal layer, wherein the first plating layer includes a first-first layer and a first-second layer on the first-first layer, the second plating layer includes a second-first layer and a second-second layer on the second-first layer, the second-second layer includes a different metal from the first-second layer, and a protective layer is disposed on the second-second layer, and the protective layer includes a metal having lower reactivity than the second-second layer.