Smart Interconnect for Modular Embedded Devices

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Solution Overview

Problem

Current stack-based architectures for modular multi-component embedded devices lack the ability to dynamically reconfigure and adapt functionalities without physical changes, limiting their versatility and adaptability in performing multiple functions.

Innovation Solution

A smart interconnect system that allows hardware boards to be reconfigured by altering the functionality of individual boards through reprogramming computing elements, using data and control buses to dynamically change configurations and implement new functionalities, enabling the stack to perform various tasks based on user-defined requirements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If stack-based architectures use fixed hardware board couplings, then device complexity is reduced and ease of manufacture is improved, but adaptability and versatility are limited

Engineering Contradiction:
Improvefunctional adaptabilityVSAvoidreconfiguration complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent implements dynamic reconfiguration of hardware board couplings through reconfigurable interconnects that can change their connectivity topology at runtime. The interconnect includes switchable pathways that allow data and control buses to be dynamically routed between different hardware boards based on functional requirements, enabling the system to adapt its architecture without physical changes.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The reconfigurable interconnect serves multiple functions: it acts as a data bus, control bus, and configuration interface simultaneously. The same interconnect infrastructure supports both fixed and dynamic coupling modes, allowing the system to function as different architectures depending on operational needs, thereby improving versatility without proportionally increasing complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If hardware boards are physically reconfigured to change functionality, then adaptability is improved, but loss of time and ease of operation deteriorate

Engineering Contradiction:
Improvefunctional reconfigurabilityVSAvoidreconfiguration time
Core Design Contradiction:
Adaptability or versatilityVSLoss of time

Solution Approach 1:

The patent replaces mechanical/physical reconfiguration operations with electronic/software-based reconfiguration. Instead of physically moving or reconnecting hardware boards, the system uses software-controlled signals to reconfigure the interconnect pathways and computing element functionalities, reducing reconfiguration time from manual intervention to automated electronic switching.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The system pre-establishes reconfiguration pathways and computing element states that can be quickly activated. Configuration data and control signals are prepared in advance, allowing the interconnect to switch between functional modes rapidly without requiring sequential physical manipulation of components during the reconfiguration process.

Inventive Principle:
Principle #10Preliminary action

3Adaptability or versatility

If computing elements are reprogrammed to alter board functionality, then versatility is improved, but device complexity and difficulty of detecting and measuring increase

Engineering Contradiction:
Improvefunctional programmabilityVSAvoidconfiguration verification
Core Design Contradiction:
Adaptability or versatilityVSDifficulty of detecting and measuring

Solution Approach 1:

The reconfigurable interconnect includes feedback mechanisms that monitor and report the current configuration state of computing elements and bus couplings. Configuration status signals provide real-time information about the programmed state of computing elements, enabling automated verification and detection of the current functional mode without requiring complex external measurement equipment.

Inventive Principle:
Principle #23Feedback

Data Source

PatentUS7636796B2Smart interconnect for modular multi-component embedded devices
Publication Date: 2009.12.22 MICROSOFT TECHNOLOGY LICENSING LLC
  • US7636796B2 patent drawing
  • US7636796B2 patent drawing
  • US7636796B2 patent drawing

AI summary

A smart interconnect for modular multi-component embedded devices is described. In an embodiment of a smart interconnect for modular multi-component embedded devices, a desired functionality of a stack of hardware boards is accessed. For example, a user may select a new functionality for the stack of hardware boards. The desired functionality is then transmitted to a board in the stack of hardware boards and the board is configured to implement the desired functionality of the stack of hardware boards.