Smart Ring Edge Rib Laser Etching for Epoxy Waterproofing
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Solution Overview
Problem
Smart rings face challenges in balancing aesthetics and functionality, particularly in achieving effective waterproofing while maintaining decorative elements, which often compromise the appearance due to difficulties in polishing and treating surfaces with integrated decorative features.
Innovation Solution
The manufacturing process involves forming the band and decorative element separately, with pre-treatment steps like polishing, followed by laser welding the decorative element onto the band, and subsequent laser etching of an edge rib on the inner surface to enhance epoxy bonding and waterproofing, allowing for improved water resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If decorative elements are integrated onto the smart ring, then aesthetic appeal is improved, but manufacturing complexity and polishing difficulty increase
Solution Approach 1:
The smart ring is divided into separate components: a band and a decorative element. The decorative element is manufactured separately and then attached to the band using laser welding. This segmentation allows each component to be polished and treated independently, simplifying the manufacturing process while maintaining aesthetic appeal.
Solution Approach 2:
The band undergoes pre-treatment polishing and surface preparation before the decorative element is attached. This preliminary action ensures that the band is ready for the decorative element and allows the decorative element to be treated separately, reducing overall manufacturing complexity.
2Reliability
If waterproofing measures are added to the smart ring, then water resistance is improved, but device complexity increases
Solution Approach 1:
An epoxy coating is applied as a thin film over the electronic components on the inner surface of the band. This epoxy layer acts as a waterproof barrier, protecting the electronics from water intrusion while maintaining a simple overall device structure without requiring complex waterproofing mechanisms.
3Reliability
If the inner surface is treated for epoxy bonding, then waterproofing is improved, but manufacturing steps increase
Solution Approach 1:
The inner surface of the band is laser etched and treated with a primer before epoxy application. These preliminary actions create a textured surface that enhances epoxy adhesion and ensure proper bonding, while being integrated into the existing manufacturing flow to minimize additional complexity.
Solution Approach 2:
Traditional mechanical surface treatment methods are replaced with laser etching technology. The laser provides precise, controlled surface texturing that enhances epoxy bonding without requiring multiple mechanical processing steps, thereby improving bonding strength while keeping manufacturing relatively simple.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of aesthetically pleasing smart rings with enhanced waterproofing capabilities, capable of withstanding pressures equivalent to 50 meters underwater, ensuring the ring remains functional and stylish during daily activities.
Implementation Method 1
subsequent to including the electronic components within the inner surface a method of manufacturing for laser etching a portion of the inner surface
Implementation Method 2
The decorative element may be attached to the outer surface of the band by a laser welding technique
Data Source
AI summary
Smart rings and methods of manufacturing smart rings are provided. A waterproof design and method of manufacturing of a smart ring, in accordance with one implementation, includes a band having at least an outer surface and an inner surface. The inner surface of the band includes features configured to support electronic components. The waterproofing design and method of manufacturing includes a laser etching a portion of the inner surface and subsequent to the laser etching of the portion, applying an epoxy over the electronic components and over the laser etched portion of the inner surface. Prior to the laser etching, forming an edge rib on the portion of the inner surface, wherein the laser etching is subsequently on the edge rib. Furthermore, the laser etched portion includes an increased contact area for bonding with the epoxy for the waterproof design.


