Smart Ring Inner Molding for Custom Fit and Clear Sensing Windows
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Solution Overview
Problem
Existing smart ring manufacturing methods are limited in accommodating various inner shapes and sizes, require excessive equipment and time, struggle with transparency adjustment, and inefficiently remove air bubbles, leading to increased costs and reduced product quality.
Innovation Solution
A method involving an outer cover unit processing, sensor/communication module assembly, inner molded unit formation with transparent thermosetting plastic, and transparency-adjusted clear coating to form sensing windows, allowing for customizable inner shapes and sizes with improved transparency and efficient bubble removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional molding techniques with fixed molds are used, then manufacturing process is simple, but adaptability to various inner shapes and sizes is poor
Solution Approach 1:
The patent employs a 3D printed mold that can be dynamically adjusted and reconfigured through software control, allowing the same physical mold to adapt to different ring inner shapes and sizes. This dynamic capability eliminates the need for multiple fixed molds while maintaining manufacturing simplicity.
Solution Approach 2:
The invention changes the key parameter of mold geometry through digital modeling and 3D printing, rather than through physical mold modifications. By altering digital parameters and reprinting the mold as needed, the system achieves high adaptability without increasing device complexity.
2Manufacturing precision
If multiple molds and equipment are prepared for various shapes and sizes, then manufacturing precision is improved, but time and cost increase
Solution Approach 1:
The patent performs preliminary digital modeling and simulation of the mold design before actual manufacturing. This allows optimization of the mold structure for precision while minimizing physical trial-and-error, reducing both development time and cost.
Solution Approach 2:
Instead of creating multiple physical molds, the invention uses digital copies and 3D printing to replicate mold geometries. This approach maintains manufacturing precision while dramatically reducing the time and resources required compared to traditional mold-making processes.
3Ease of manufacture
If epoxy molding is used with conventional injection units, then manufacturing process is simple, but transparency adjustment is limited and air bubble removal is inefficient
Solution Approach 1:
The patent introduces a new dimension to the injection system by using a multi-nozzle array configuration rather than a single injection point. This dimensional change in the injection approach enables better material distribution, improved transparency, and more effective air bubble entrapment and removal while maintaining process simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables flexible smart ring production with varied inner shapes and sizes, enhances transparency for better signal sensing, and accelerates bubble removal, thus reducing costs and improving product quality and efficiency.
Implementation Method 1
filling a molding member in the entire inner area of the ring-shaped assembly, and cutting a hole of a predetermined shape
Data Source
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AI summary
Disclosed are a method of manufacturing a smart ring and a smart ring manufactured through the method. The method of the present invention comprises: an outer cover unit processing process (S110) of processing and manufacturing an outer cover unit 100 having a ring shape of a smart ring and accommodating a sensor/communication module; a sensor/communication module manufacturing process (S120) of manufacturing the sensor/communication module 200 including a sensor module for sensing a biological signal of a smart ring user; an outer cover unit and sensor/communication module assembly manufacturing process (S200) of forming a ring-shaped outer cover unit and sensor/communication module assembly by accommodating the sensor/communication module 200 in the ring-shaped inside of the outer cover unit 100; an inner molded unit processing process (S300) of creating an inner molded unit 300 having a hole of a predetermined shape, into which a smart ring user's finger is inserted, inside the ring-shaped outer cover unit and sensor/communication module assembly; a sensing window forming process (S400) of forming a sensing window, which is an area that passes a signal or light needed for the sensor module to sense biological signals of the smart ring user, on an inner surface of the inner molded unit 300, wherein in the inner molded unit processing process (S300), the inner molded unit 300 is created by filling a molding member in an entire inner area of the ring-shaped assembly, and cutting a hole of a predetermined shape at a center of the filled molding member.