Smart Self-Repair Device for Semiconductor Memory Yield
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional package self-repair technologies are limited in repairing column-oriented failures in semiconductor memory devices, leading to decreased package yield and prolonged yield ramp-up time due to the lack of column redundancy usage.
Innovation Solution
A smart self-repair device and method that includes an array rupture electrical fuse (ARE) array and a self-repair control block to analyze fail modes and selectively perform row or column redundancy repairs based on fail addresses, enabling efficient repair of various failure modes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of repair
If only row redundancy is used for self-repair, then the repair operation is simple, but column-oriented failures cannot be repaired and package yield decreases
Solution Approach 1:
The self-repair device is enhanced to perform multiple repair functions by supporting both row redundancy and column redundancy operations. The control logic was expanded to identify different failure modes (row-oriented, column-oriented, or both) and automatically select the appropriate repair strategy, making the system universally applicable to various failure scenarios rather than limited to a single repair direction.
Solution Approach 2:
The repair system was made dynamic by introducing real-time failure mode analysis. The control block examines the fail address and determines whether the failure is row-oriented, column-oriented, or both, then dynamically adjusts the repair operation accordingly. This dynamic adaptation allows the system to optimize repair effectiveness based on the specific failure characteristics rather than using a fixed repair approach.
2Measurement precision
If wafer test conditions are diversified and package yield checking is repeated multiple times to achieve saturation, then package yield accuracy is improved, but yield ramp-up time lengthens and more experiment equipment is needed
Solution Approach 1:
The device implements self-service by automatically analyzing failure modes and selecting appropriate repair operations without requiring external intervention. The control block autonomously determines whether row or column redundancy should be applied based on the fail address analysis, eliminating the need for manual configuration of diverse test conditions and multiple yield checking iterations. This automation significantly reduces the time required to achieve yield saturation while maintaining measurement precision.
Data Source
AI summary
A smart self-repair device includes an ARE array configured to store information on respective bits of a fail address in fuses; a self-repair control block configured to store a row address and a column address corresponding to a fail bit when a fail occurs, analyze a fail mode by comparing the fail address inputted in a test and the stored addresses, and output fail address information and row fuse set information or column fuse set information according to the fail mode; a data control block configured to output repair information to the ARE array according to the fail address information and the row fuse set information or the column fuse set information; and a rupture control block configured to control a rupture operation of the ARE array.