Smart Self-Repair Device for Semiconductor Package Yield

Solution Overview

Problem

Conventional package self-repair methods in semiconductor memory devices are limited, as they only use row redundancy, making it impossible to repair column-oriented failures, which decreases package yield and lengthens yield ramp-up time, requiring multiple experimental equipment and repetitive testing.

Innovation Solution

A smart self-repair device and method that includes a fuse array for storing fail address information and a self-repair control circuit to control the repair of target mats and adjacent mats, using both row and column redundancies based on fail mode analysis, allowing for efficient repair of various fail modes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If only row redundancy is used in package self-repair, then the repair process is simple, but column-oriented failures cannot be repaired, decreasing package yield

Engineering Contradiction:

Improverepair process complexityVSAvoidpackage yield

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The self-repair control circuit is designed to handle multiple failure types (row-oriented and column-oriented) using a unified repair architecture. The circuit can selectively activate row redundancy or column redundancy based on the detected fail mode, making the repair system universal and capable of addressing various failure scenarios without requiring separate repair mechanisms for each type.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The repair system dynamically adapts its behavior based on the detected failure mode. The self-repair control circuit analyzes the fail address and determines whether to activate row redundancy or column redundancy, allowing the repair process to flex and adapt to different failure conditions rather than using a fixed, static repair approach.

Inventive Principle:

Principle #15Dynamics

2Device complexity

If only row redundancy is used, then the device structure is simple, but yield ramp-up time increases and multiple experimental equipment are needed

Engineering Contradiction:

Improveredundancy structureVSAvoidyield ramp-up time

Core Design Contradiction:

Device complexityVSLoss of time

Solution Approach 1:

The self-repair control circuit is designed to handle multiple failure types (row-oriented and column-oriented) using a unified repair architecture. The circuit can selectively activate row redundancy or column redundancy based on the detected fail mode, making the repair system universal and capable of addressing various failure scenarios without requiring separate repair mechanisms for each type.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The fuse array pre-stores fail address information for both row and column redundancies, allowing the repair system to be prepared in advance with multiple repair options. This preliminary preparation enables faster yield ramp-up by eliminating the need for extensive real-time experimentation and equipment switching during the repair process.

Inventive Principle:

Principle #10Preliminary action

3Ease of operation

If conventional package self-repair is used, then the repair operation is simple, but column-oriented fails cannot be repaired

Engineering Contradiction:

Improverepair operation simplicityVSAvoidfailure mode coverage

Core Design Contradiction:

Ease of operationVSAdaptability or versatility

Solution Approach 1:

The repair system dynamically adapts its behavior based on the detected failure mode. The self-repair control circuit analyzes the fail address and determines whether to activate row redundancy or column redundancy, allowing the repair process to flex and adapt to different failure conditions rather than using a fixed, static repair approach.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The self-repair control circuit incorporates feedback mechanisms to detect the failure mode and adjust the repair strategy accordingly. By monitoring the fail address and determining the appropriate redundancy type, the system creates a closed-loop feedback process that ensures correct repair selection based on actual failure conditions.

Inventive Principle:

Principle #23Feedback

Data Source

PatentUS9653181B1Smart self-repair device and method of self-repairing a package

Publication Date: 2017.05.16 SK HYNIX INC

AI summary

A smart self-repair device and method of self-repairing a package is disclosed. The smart self-repair device may include a fuse array configured to store information regarding respective bits of a fail address in fuses. The smart self-repair device may include a self-repair control circuit configured to control repairing of not only a target mat in which a fail occurs, but also adjacent upper and lower mats sharing a sense amplifier along with the target mat, and to output fail address information corresponding to a fail mode, and row fuse set information or a column fuse set information. The smart self-repair device may include a data control circuit configured to output repair information to the fuse array based on the fail address information and the row fuse set information or the column fuse set information, and may include a control circuit configured to control a rupture operation of the fuse array.