Compact Smart Sensor Device for Machinery Condition Monitoring
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Solution Overview
Problem
Current condition monitoring systems for machinery lack efficient methods for collecting and analyzing vibration and temperature data, leading to inadequate detection of machine failures and increased maintenance needs.
Innovation Solution
A smart sensor device with a PCB assembly, including a processor, sensors for vibration and temperature measurement, and a wireless communication interface, designed to be compact, energy-efficient, and capable of operating in both sleep and active states to continuously monitor machine conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a smart sensor device with multiple sensors and wireless communication interface is implemented, then measurement precision and reliability of condition monitoring are improved, but device complexity increases
Solution Approach 1:
The patent combines multiple sensors (vibration sensor and temperature sensor) along with processing units and wireless communication interfaces into an integrated smart sensor device. The sensors are mounted on a common base structure with the PCB assembly, creating a unified monitoring unit that reduces system complexity while maintaining high measurement precision through multi-parameter detection.
2Reliability
If continuous monitoring is performed to detect machine failures early, then reliability of condition monitoring is improved, but energy consumption increases
Solution Approach 1:
The smart sensor device employs periodic monitoring with sleep mode capabilities. The vibration sensor can operate in a sleep state to conserve energy, waking up only when necessary to perform measurements. This periodic action allows the system to maintain reliability through continuous monitoring capability while significantly reducing energy consumption during idle periods.
3Ease of operation
If the device is designed to be compact with small dimensions, then ease of installation is improved, but the size of sensors and components is constrained
Solution Approach 1:
The patent employs a nested structure where the PCB assembly is positioned within the enclosure assembly, and sensors are mounted on the base which is part of the enclosure. The vibration sensor and temperature sensor are integrated into the base structure, allowing compact packaging. This nesting approach enables the device to maintain small dimensions for easy installation while accommodating all necessary components.
4Measurement precision
If multiple sensors are used to monitor different parameters, then measurement precision is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent segments the device into distinct functional modules: a PCB assembly containing electronic components, a separate enclosure assembly with mounting structures, and individual sensor units. The base structure serves as a common mounting platform for both sensors. This segmentation allows each component to be manufactured and tested independently before final assembly, reducing overall manufacturing complexity while enabling multi-parameter monitoring through multiple sensors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device enhances the efficiency of condition monitoring by providing accurate and continuous data collection, reducing maintenance needs, and extending the lifetime of machinery through improved vibration and temperature analysis.
Implementation Method 1
The first sensor may be a vibration sensor and the second sensor may be a temperature sensor. In certain the vibration sensor may be an accelerometer sensor
Implementation Method 2
the temperature sensor may be a thermocouple, a thermistor, or the like
Implementation Method 3
the temperature sensor may be a thermocouple, a thermistor, or the like
Implementation Method 4
the communication interface may be a wireless communication interface and at least a portion of the cap may be substantially radio frequency (RF) transparent
Data Source
AI summary
Disclosed herein are devices, methods, and methods of making devices for facilitating condition monitoring of machinery allowing improve efficiencies and increased lifetime of the machinery while also reducing maintenance. In one embodiment, a device includes an enclosure assembly and a printed circuit board (PCB) assembly. The enclosure assembly includes a cap, a base mechanically coupled with the cap, and a support bracket mechanically coupled with the base. The PCB assembly includes a processor, a memory coupled with the processor, a first sensor electrically coupled with the processor, a second sensor electrically coupled with the processor, and a communication interface electrically coupled with the processor. The device, when installed, may generally form a shape of a tapered cylinder having a maximum height of 2.1 inches and a maximum diameter of 1.2 inches.