Smart Speaker Housing Layout for Microphone Vibration Isolation
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Solution Overview
Problem
Vibration from the speaker module is transmitted through the housing, affecting the audio-receiving effect of the microphone in smart speakers.
Innovation Solution
The microphone module is assembled in a separate housing from the speaker module, with cushioning components placed between the housings and around the speaker to absorb vibrations, increasing the distance between the speaker and microphone, thereby reducing vibration transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the microphone and speaker module are assembled in the same housing, then the device structure is simplified and compact, but the speaker vibration is transmitted through the housing affecting the microphone's audio-receiving effect
Solution Approach 1:
The housing is divided into two separate housings: a first housing for the speaker module and a second housing for the microphone module. This segmentation physically separates the vibration source from the sensitive component, preventing vibration transmission while maintaining a compact overall structure.
Solution Approach 2:
A cushioning component is introduced as an intermediary element between the first and second housings. This cushioning component absorbs and isolates vibrations from the speaker module, preventing them from being transmitted to the microphone module while still allowing the housings to be assembled together.
2Volume of moving object
If the microphone is placed close to the speaker module, then the device size is reduced, but the speaker vibration directly affects the microphone's audio reception
Solution Approach 1:
By placing the microphone module in a separate second housing from the speaker module's first housing, the design achieves physical separation without significantly increasing overall device volume. The segmented housing structure allows compact arrangement while maintaining adequate distance between components.
Solution Approach 2:
The cushioning component acts as a vibration-isolating intermediary between the closely positioned speaker and microphone modules, enabling them to be placed near each other for compact design while preventing direct vibration transmission that would interfere with audio reception.
3Object-affected harmful factors
If cushioning components are added between housings and around the speaker, then vibration transmission is reduced, but the device complexity and assembly difficulty increase
Solution Approach 1:
The cushioning components are strategically positioned at key vibration transmission paths (between housings and around the speaker), combining multiple vibration isolation functions into a integrated housing assembly structure that reduces overall complexity compared to comprehensive damping throughout the entire device.
Solution Approach 2:
The cushioning components serve as simple intermediary elements that can be easily incorporated into the housing assembly process, providing effective vibration isolation without requiring complex mechanisms or multiple assembly steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The audio-receiving effect of the microphone is preserved by minimizing direct vibration transmission from the speaker, enhancing audio quality and allowing for a better camera field of view.
Implementation Method 1
cushioning components placed between the housings and around the speaker to absorb vibrations
Data Source
AI summary
A smart speaker includes an outer casing, a speaker module, and a microphone module is provided. The outer casing includes a first housing and a second housing assembled to each other. The speaker module is disposed in the first housing. The microphone module includes a circuit board and at least one microphone. The circuit board is assembled to the second housing and separated from the first housing. The microphone is disposed on the circuit board.