Smartcards with Metal Layers Recess Design

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing data carriers with metallic layers face challenges in meeting standard thickness requirements, often necessitating reduced metallic layer thickness or weight.

Innovation Solution

A data carrier design featuring at least a first continuous metallic layer delimiting a recess, an electronic module partially arranged within the recess, an antenna connected to the electronic module, and a second metallic layer arranged after the first with respect to an extension direction, allowing for reduced thickness without compromising standard card formats.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of stationary object

If metallic layers of reduced thickness or weight are used, then standard card thickness requirements are met, but the performance and functionality of the data carrier are compromised

Engineering Contradiction:

Improvecard thicknessVSAvoiddata carrier performance

Core Design Contradiction:

Length of stationary objectVSReliability

Solution Approach 1:

The electronic module is nested within a recess formed in the first metallic layer, allowing the module to be partially embedded in the card structure. This nesting approach reduces the overall card thickness while maintaining full metallic layer functionality and performance.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

Instead of reducing metallic layer thickness in the vertical dimension, the invention redistributes space by creating a recess that allows the electronic module to occupy vertical space within the card body, thereby maintaining metallic layer integrity while achieving standard card thickness through dimensional optimization.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Reliability

If metallic layers of full thickness and weight are used, then data carrier performance is optimized, but standard card thickness requirements are not met

Engineering Contradiction:

Improvedata carrier performanceVSAvoidcard thickness

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

Inventive Principle:

Principle #7Nested doll (Nesting)

3Length of stationary object

If the electronic module is arranged within a recess of the first metallic layer, then the data carrier thickness is reduced, but the structural complexity increases

Engineering Contradiction:

Improvecard thicknessVSAvoidstructural complexity

Core Design Contradiction:

Length of stationary objectVSDevice complexity

Solution Approach 1:

The first metallic layer is segmented to form a recess that accommodates the electronic module. This segmentation allows the module to be integrated into the card structure without requiring complete thickness reduction of the metallic layers, balancing structural complexity with thickness reduction.

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS20250053766A1Smartcards with metal layers

Publication Date: 2025.02.13 THALES DIS FRANCE SA

AI summary

Provided is a data carrier comprising at least a first metallic layer, at least one electronic module, at least one antenna, and at least a second metallic layer. The second metallic layer is arranged after the first metallic layer with respect to an extension direction (E). The antenna is in connection with the electronic module. The first metallic layer is a continuous metallic layer delimiting a recess, and wherein the electronic module is at least partially arranged within said recess. Other embodiments disclosed.