Smartcard Module Layout With Embedded Chip and Flat Contact Grid
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Solution Overview
Problem
The existing manufacturing methods for smartcard modules result in a brittle and flexible printed circuit with a protrusion, which is costly to produce and limits the size of the integrated circuit due to thickness constraints, leading to deformation and increased manufacturing costs.
Innovation Solution
A method involving a metal foil with markers, where an electronic component is integrated into the thickness of the printed circuit, allowing for a homogeneous thickness without protrusions, achieved through steps like dielectric material deposition, conducting layer formation, and etching to create a contact grid, enabling a thicker and less flexible printed circuit that accommodates larger chip sizes while reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the printed circuit thickness is reduced to less than 200 micrometers to accommodate the smartcard thickness requirement, then the smartcard can be assembled, but the printed circuit becomes very flexible and the chip size must be limited to prevent breaking
Solution Approach 1:
The chip is placed and connected during the manufacturing of the printed circuit, before the circuit is installed in the smartcard. This preliminary integration allows the chip and circuit to be manufactured together as a unified structure, enabling the use of a thicker, more rigid printed circuit without compromising the final assembly fit.
Solution Approach 2:
The patent changes the thickness parameter of the printed circuit from the conventional less than 200 micrometers to a greater thickness, which increases rigidity and allows larger chip sizes. This parameter change is made possible by the integrated manufacturing approach that accommodates the chip within the circuit structure.
2Ease of operation
If a double cavity is created in the smartcard to receive the module protuberance, then the module can be assembled, but the manufacturing cost increases and a brittle zone is created
Solution Approach 1:
The patent removes the protuberance feature from the module design by integrating the chip within the printed circuit thickness. This extraction of the protruding element eliminates the need for the complex double cavity structure in the smartcard, simplifying both the module and card designs while reducing manufacturing costs.
Solution Approach 2:
Instead of creating cavities in the smartcard to accommodate a protruding module, the invention inverts the approach by making the module flat and integrating the chip within the circuit thickness. This inversion eliminates the need for complex cavity machining or molding in the smartcard body.
3Length of stationary object
If the printed circuit layers are reduced in thickness to achieve a thin circuit, then the smartcard thickness requirement is met, but the chip size must be limited to prevent breaking due to bending
Solution Approach 1:
The chip is placed and connected during the manufacturing of the printed circuit, allowing the chip size to be determined by design requirements rather than being constrained by the flexibility of a thin printed circuit. This preliminary integration enables the use of larger chips without risk of breaking during assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method produces a smartcard module with a reduced thickness, increased chip size capability, and lower manufacturing costs, simplifying smartcard assembly and reducing flexibility issues, while maintaining a robust structure.
Implementation Method 1
depositing a first layer of dielectric material on the upper face of the metal foil and on the electronic component
Implementation Method 2
depositing a first conducting layer covering the entire surface of the first layer of dielectric material; depositing a second conducting layer filling the openings
Implementation Method 3
etching the first metal foil and the first conducting layer in order to create patterns of conductors, the etching of the first metal foil forming a smartcard contact grid
Data Source
AI summary
The invention relates to a method for manufacturing a smartcard module wherein an electronic component is mounted on an upper face of a metal foil and then covered with a first layer of dielectric material. Openings are made in the first layer of hardened dielectric material and then everything is covered with a conducting layer that fills the openings. The metal foil and the conducting layer are etched so as to create patterns of conductors. The invention also relates to a smartcard module wherein an integrated circuit is placed between a first and a second metallic layer inside a layer of dielectric material. The invention also relates to the smartcard module thus obtained.