Smartphone Sound-Emitting Assembly With Nested Acoustic Cavities
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Solution Overview
Problem
The integration of multiple components into smartphones' motherboards limits layout space, and existing stereo solutions either cause excessive vibration or occupy valuable space, leading to poor sound performance or reduced motherboard area.
Innovation Solution
The electronic device utilizes internal components to form a closed sound cavity, reducing speaker size while increasing sound volume, using sound guide holes and gaps to enhance stereo effect without causing vibration, and incorporating sealing members for leakproofness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If speakers are configured at the top and bottom of the smartphone to achieve stereo effect, then sound quality is improved, but the layout space is reduced and vibration problems occur
Solution Approach 1:
The sound cavity is nested within the installation cavity formed by the back shell and middle frame. The housing with first cavity is nested within the installation cavity, and the sound-emitting component is nested within the first cavity. This nested structure allows the sound system to utilize the space between existing structural components (back shell and middle frame) without requiring additional dedicated space, thereby resolving the contradiction between achieving stereo sound quality and maintaining adequate layout space.
Solution Approach 2:
The installation cavity formed by the back shell and middle frame serves multiple functions: it provides structural support for the device and simultaneously serves as the sound cavity for the speaker assembly. The back shell and middle frame are not only structural components but also acoustic components that define the sound emission space. This multi-functionality reduces the need for dedicated sound cavity space, addressing the layout space constraint while maintaining sound quality.
2Reliability
If speakers are configured at the top and bottom of the smartphone to achieve stereo effect, then sound quality is improved, but excessive vibration occurs
Solution Approach 1:
The housing acts as an intermediary structure between the sound-emitting component and the installation cavity. It provides acoustic isolation and structural buffering, preventing direct transmission of vibrations from the sound-emitting component to the back shell and middle frame. The sound guide holes in the housing control the acoustic coupling while maintaining mechanical decoupling, thereby reducing vibration transmission while preserving sound quality.
3Area of stationary object
If internal components are used to form sound cavity, then space utilization is improved, but sealing requirements increase
Solution Approach 1:
The sound cavity is segmented into multiple sealed regions: the first cavity within the housing, the installation cavity between the back shell and middle frame, and the sound transmission path through sound guide holes. Each segment is sealed independently using sealing members at critical interfaces (housing to middle frame, housing to first structural member/circuit board). This segmentation allows the system to utilize internal space effectively while maintaining reliable sealing through localized sealing solutions at each interface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves better sound quality with a stereo effect, prevents vibration, and optimizes space utilization, allowing for improved sound performance and increased battery capacity.
Implementation Method 1
The sound-emitting assembly includes a housing and a sound-emitting component. The housing is provided with a first cavity, and the sound-emitting component is located in the first cavity and divides the first cavity into a front cavity and a rear cavity. The housing is further provided with a first sound guide hole and a second sound guide hole.
Implementation Method 2
The first structural member is provided with a leakage hole. The leakage hole communicates with the first space, and a damping mesh is disposed in the leakage hole.
Data Source
AI summary
An electronic device includes a display module, a middle frame, a sound-emitting assembly, a first circuit board, a first structural member, and a back shell. The middle frame is provided with an accommodating groove. The display module is disposed in the accommodating groove. The sound-emitting assembly, the first circuit board, the first structural member, and the back shell are disposed on a side, away from the display module, of the middle frame. The sound-emitting assembly, the first circuit board, and the first structural member are located in an installation cavity formed by the back shell and the middle frame. The sound-emitting assembly includes a housing and a sound-emitting component. The housing is provided with a first cavity, and the sound-emitting component is located in the first cavity. The first structural member and the first circuit board form first space by enclosure.