Surface Mount Device Electrode Segmentation for Thermal Dissipation
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Solution Overview
Problem
The mounting of electronic devices on circuit boards can be challenging, leading to accuracy degradation and potential failure over time due to poor adhesion and heat dissipation issues, especially in varying environmental conditions.
Innovation Solution
A surface mount device with a casing and electrodes designed to stabilize and dissipate heat from optoelectronic elements, featuring a chip carrier part and electrodes that are thermally and electrically conductive, with a recess and insulation gap to enhance adhesion and structural integrity, using materials like plastic and ceramic for the casing and conductive materials for the electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional mounting methods are used, then manufacturing simplicity is maintained, but adhesion strength deteriorates leading to device failure over time
Solution Approach 1:
The electrode is divided into multiple segments including a body portion, a mounting portion with mounting holes, and connection portions. This segmentation allows the mounting portion to be securely attached to the circuit board through the holes while the body portion maintains electrical connection, thereby improving both adhesion strength and device reliability without complicating the manufacturing process.
2Temperature
If heat dissipation structures are added, then thermal management is improved, but device complexity increases
Solution Approach 1:
The electrode serves multiple functions simultaneously: it provides electrical connection, structural support, and heat dissipation. The conductive material in the electrode body and mounting portions acts as a heat sink, conducting heat away from the optoelectronic device without requiring separate heat dissipation structures, thus improving thermal management while maintaining structural simplicity.
3Manufacturing precision
If mounting holes are added to electrodes, then adhesion and positioning are improved, but manufacturing complexity increases
Solution Approach 1:
The mounting holes are pre-formed in the electrode mounting portions before the final assembly process. This preliminary action allows for precise positioning of the optoelectronic device during mounting, as the holes provide predetermined locations for attachment. The holes can be created using standard drilling or punching techniques during electrode fabrication, avoiding the need for complex post-processing alignment operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved stability and reliability of optoelectronic devices by enhancing adhesion and heat dissipation, maintaining accurate positioning and performance even in harsh conditions, thus reducing the risk of device failure.
Implementation Method 1
a chip carrier part and electrodes that are thermally and electrically conductive
Implementation Method 2
using materials like plastic and ceramic for the casing
Data Source
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AI summary
Surface mount devices (100,500) are provided, which include a first electrode (110,510) comprising a chip carrier part (120,505), a second electrode (115,515) disposed proximate to the chip carrier part, and a casing (105,505) encasing a portion of the first and second electrodes. The first electrode (110,510) can extend from the chip carrier part toward a perimeter of the casing, and the second electrode (115,515) can extend away from the chip carrier part (120,520) and projects outside of the casing (105,505). In extending away from the chip carrier part the first electrode (110,510) divides into a plurality of leads(320,325,720,725,726) separated by an aperture (345) that join into a single first joined lead portion (330) with a First width before projecting outside the casing and maintains the first width outside of the casing. The second electrode (115,515) can attain a second width prior to projecting outside of the casing and maintains the second width outside the casing.