SMD Integration in IC Housing with Profiled Adhesive Barriers
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Solution Overview
Problem
Existing electronic components face issues with adhesive bleeding during mounting, leading to uncontrolled spreading and compromised bondability, and previous methods to address this, such as using solder resist masks, incur additional costs and process complexities.
Innovation Solution
The electronic component features mechanically profiled barriers on the support platform and connecting leads, formed as trenches or elevations during manufacturing, which prevent adhesive flow without requiring changes to the backend process, thus reducing costs and process times.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive bonding is used to mount SMD components on the lead frame, then electrical connection is achieved, but adhesive bleeding occurs causing uncontrolled spreading and loss of bondability
Solution Approach 1:
The support platform is segmented into different functional areas by profiled barriers that divide the surface into a mounting area for SMD components and other areas. This segmentation prevents adhesive from spreading uncontrollably while maintaining electrical connection functionality.
Solution Approach 2:
The support platform features locally differentiated properties through profiled barriers with specific heights and geometries. These barriers create distinct zones with different adhesive resistance characteristics, allowing controlled adhesive flow in mounting areas while preventing bleeding in other regions.
2Object-generated harmful factors
If solder resist masks are used to prevent adhesive bleeding, then adhesive control is improved, but additional costs and process steps are incurred
Solution Approach 1:
The barrier structure is merged with the support platform itself, integrating the adhesive prevention function into the base component. This eliminates the need for separate solder resist masks and their associated application, curing, and development processes.
Solution Approach 2:
The support platform provides its own adhesive bleeding prevention function through integrated profiled barriers, making the system self-sufficient without requiring external solder resist materials or additional processing steps.
3Object-generated harmful factors
If solder resist masks are applied and cured to prevent adhesive bleeding, then adhesive control is achieved, but production time increases
Solution Approach 1:
The profiled barriers are formed on the support platform during its manufacturing process before the actual assembly takes place. This preliminary structuring eliminates the need for time-consuming post-manufacturing steps like solder resist application, curing, and development.
Solution Approach 2:
The invention skips the entire solder resist mask process chain by using pre-formed structural barriers. This allows the manufacturing process to move directly from support platform preparation to component mounting, significantly reducing production time.
Data Source
AI summary
The invention relates to an electronic component having a semiconductor component, particularly a semiconductor chip, and at least one SMD component, a chip carrier with a support platform and with connecting leads. Whereby the semiconductor component, which is connected electrically via chip bonds to bond fingers of the connecting leads is mounted on the support platform and the SMD component connects the support platform to a connecting lead via contact surfaces arranged thereon, a housing, which encloses the semiconductor component, the SMD component, and at least partially the chip carrier. The support platform and the connecting lead in the area of the SMD component are profiled to create barriers in such a way that flowing of a free-flowing material from the contact surfaces connected to the SMD component of the chip carrier both onto the support platform and onto the connecting lead is prevented.