SMD IPD Anti-Fuse Placement in Package-on-Package
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The semiconductor industry faces challenges in integrating smaller electronic components into smaller packages while ensuring reliable electrical connections and avoiding air gaps that can cause structural failures during thermal cycling.
Innovation Solution
The integration of surface mount devices (SMDs) or integrated passive devices (IPDs) as anti-fuses in a package-on-package structure, where these devices are externally placed to create closed-loop circuits and are mechanically and electrically coupled to redistribution structures, allowing for flexible placement and reducing the risk of air gaps through the use of spacer materials and encapsulants.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If surface mount devices or integrated passive devices are externally placed in a package-on-package structure, then flexibility in anti-fuse placement and circuit programming reliability are improved, but device complexity and manufacturing process difficulty increase
Solution Approach 1:
The invention divides the anti-fuse functionality into separate external devices (SMDs or IPDs) that can be independently placed and connected to different pads on the substrate, rather than integrating all anti-fuse elements within a single chip. This segmentation allows flexible placement and independent programming of multiple anti-fuse locations.
Solution Approach 2:
The invention introduces an encapsulant material as an intermediary between the substrate and the externally placed anti-fuse devices. This encapsulant provides mechanical support, electrical insulation, and environmental protection, enabling reliable integration of external components while managing thermal expansion differences.
2Quantity of substance
If smaller electronic components are integrated into smaller packages, then integration density is improved, but the risk of air gaps causing structural failures during thermal cycling increases
Solution Approach 1:
The encapsulant material serves as a mediator between components with different thermal expansion coefficients, providing a compliant interface that accommodates thermal cycling stresses and prevents air gap formation that would otherwise cause structural failures.
Solution Approach 2:
The invention changes the physical state and properties of the packaging material by using a cured encapsulant that fills voids and creates a homogeneous structure, transforming discrete components with air gaps into an integrated assembly with uniform thermal and mechanical properties.
3Ease of manufacture
If fuse blowing is used for programming circuits, then programming simplicity is maintained, but manufacturing complexity and potential structural damage increase
Solution Approach 1:
The invention performs the circuit programming action in advance during the packaging process itself, by selectively placing or connecting anti-fuse devices before final assembly. This preliminary action eliminates the need for subsequent fuse blowing operations, simplifying manufacturing while maintaining programming capability.
Data Source
AI summary
Various package structures and methods of forming package structures are described. According an embodiment, a structure includes a first package and a package component attached to the first package by external connectors. The first package comprises a device attached to a first pad and a second pad. The device is a surface mount device (SMD), an integrated passive device (IPD), or a combination thereof. The device is attached to the first pad and the second pad through a dielectric layer. A spacer material is disposed laterally between the first pad and the second pad and is disposed between the device and the dielectric layer. An encapsulant surrounds the device and the spacer material.