SMD LED Module Resin Molding for Color Shift Reduction
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Solution Overview
Problem
Conventional SMD LED display modules experience significant color shift over viewing angles due to uneven top surfaces and light leakage from irregular resin encapsulation, leading to image blurriness and reduced contrast.
Innovation Solution
The implementation of a light emitting diode (LED) display module with a specific resin molding structure, featuring a black resin portion to block sidewall light emission and a second transparent resin portion to create a uniform surface, which includes an array of surface-mount devices (SMDs) arranged in rows or columns on a substrate with red, green, and blue LED chips, and additional transparent resin to fill spaces between SMDs, thereby minimizing color shift.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If transparent resin encapsulation is used around LED chips, then light emission is enabled, but color shift occurs due to uneven top surfaces and light leakage
Solution Approach 1:
The resin encapsulation is divided into multiple functional portions: a first transparent resin portion that directly encapsulates the LED chips, a black resin portion that fills spaces between SMDs to block sidewall light emission, and a second transparent resin portion that creates a uniform top surface. This segmentation allows each portion to perform its specific function optimally.
Solution Approach 2:
Different regions of the resin structure are assigned different optical properties: transparent regions where light emission is needed, and black light-blocking regions where light leakage must be prevented. The black resin portion is strategically placed only in inter-SMD spaces to block sidewall emission without affecting the light output from LED chips.
2Manufacturing precision
If black sidewall is used to block sidewall light emission, then color shift is reduced, but top surface becomes uneven
Solution Approach 1:
The solution adds a vertical dimension by stacking multiple resin portions. The first transparent resin portion maintains contact with the black sidewall for light blocking, while the second transparent resin portion is added on top to create a uniform upper surface. This multi-layer approach resolves the surface unevenness problem without removing the light-blocking function.
3Strength
If resin fills spaces between SMDs, then structural integrity is improved, but light leakage from sidewalls increases
Solution Approach 1:
The resin structure combines transparent and black materials in a composite configuration. The black resin portion fills the spaces between SMDs to block light leakage, while the transparent resin portions maintain structural integrity and enable light emission. This composite approach simultaneously achieves both structural strength and light control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces color shift and enhances image uniformity and contrast by blocking noisy light and ensuring consistent light emission patterns across viewing angles.
Implementation Method 1
a black resin portion molded around each SMD in a manner to fill spaces between SMDs so as to prevent light from emitting from a sidewall of the SMD
Implementation Method 2
a first transparent resin portion molded around the LED chips... and a second transparent resin portion molded on the first transparent resin portion
Data Source
AI summary
A light emitting diode (LED) display module includes an array of surface-mount devices (SMDs) arranged in rows and columns on a substrate. Each SMD has red, green, and blue LED chips connected to the substrate and a first transparent resin portion molded around the LED chips; a black resin portion molded around each SMD in a manner to fill spaces between SMDs so as to block light emitted from a sidewall of each SMD; and a second transparent resin portion molded on the first transparent resin portion and the black resin portion.