SMD LED Package Supporting Stand for Surface-Mount Assembly
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Solution Overview
Problem
Existing LED package devices face challenges in standing on a circuit board substrate without additional components and require complex circuit designs due to protruding metal supporting frames, which complicates the assembly process and limits their application in high-density outdoor digital signage.
Innovation Solution
A surface-mount-device (SMD) type LED package device with a packaging body featuring a lens portion and a supporting portion, where the supporting portion includes a circumferential surface and a bottom surface with a supporting stand, allowing the device to stand on a predetermined assembling plane without extra components, enabling assembly via surface-mount technology.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the metal supporting frames protrude out of the bottom surface of the packaging body, then the LED package device can be assembled via traditional insertion method, but the bottom surface becomes uneven and the device cannot stand on the ground
Solution Approach 1:
The patent applies preliminary action by forming the supporting stand structure within the packaging body during the injection molding process before final assembly. The mold cavity includes a supporting portion that forms an inward-curving arc surface with a predetermined assembling plane, ensuring the bottom surface is flat and level before the LED package device is assembled. This preliminary preparation of the supporting structure eliminates the need for post-assembly adjustments and ensures the device can stand upright.
2Reliability
If the metal supporting frames are inserted through perforations on both sides of the circuit board substrate, then electrical connection is achieved, but the circuit design becomes complex and assembly difficulty increases
Solution Approach 1:
The patent applies dimensionality change by transitioning from a through-hole assembly method (requiring connections on both top and bottom surfaces) to a surface-mount approach where the LED package device is assembled on only one side of the circuit board substrate. The supporting stand structure enables the device to stand upright and make electrical connections through the circuit board via soldering, eliminating the need for complex through-hole circuit designs and reducing assembly complexity.
3Ease of operation
If additional components are used to enable the LED package device to stand on the circuit board substrate, then the device can be assembled via SMT, but the number of components and manufacturing complexity increases
Solution Approach 1:
The patent applies merging by integrating the supporting stand function directly into the packaging body structure. The supporting portion is formed as an integral part of the transparent packaging body during injection molding, combining the packaging function with the supporting function. This eliminates the need for separate supporting components or additional assembly steps, enabling SMT assembly while maintaining simplicity.
4Manufacturing precision
If the LED package device is arranged more tightly to increase light-emitter density, then higher resolution is achieved, but the complex circuit design and assembly difficulty are exacerbated
Solution Approach 1:
The patent applies dimensionality change by enabling surface-mount assembly on one side of the circuit board, which allows for much tighter spacing and higher density arrangement of LED package devices compared to traditional through-hole assembly. The supporting stand structure provides stable upright positioning that facilitates precise placement and soldering, enabling high-resolution displays with increased light-emitter density while simplifying the overall assembly process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The SMD type LED package device can be assembled on one side of a circuit board without additional components, reducing assembly complexity and enabling higher density arrangements, while maintaining durability and controlled light-emitting angles.
Implementation Method 1
injecting an encapsulant 95 into the mold cavity 940; plugging an assembly of the metal supporting frames 911, 912 and the LED chip 92 into the encapsulant 95, and then curing the encapsulant 95
Implementation Method 2
the bottom surface of the packaging body 93 is uneven due to the protuberant parts around the metal supporting frames 911, 912, which are caused by capillarity phenomena
Data Source
AI summary
Disclosed is a SMD type LED package device, a method for manufacturing the same, and a light-emitting apparatus, wherein the surface-mount-device (SMD) type light-emitting diode (LED) package device comprises an assembly of an LED chip, two metal supporting frames, and a packaging body. The two metal supporting frames of the assembly are spaced apart from each other and disposed in parallel along the first axis. Each metal supporting frame has a first end electrically connected to the LED chip and a second end opposite to the first end. The packaging body has a lens portion and a supporting portion, which is integrally formed with the packaging body and covers the LED chip and the first ends of the metal supporting frames.