Surface Mounted LED Manufacturing via Wire Wrapping and Conductive Paste
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Solution Overview
Problem
Conventional semiconductor light emitting components face issues with weld quality control, leading to damage, separation, and low production efficiency due to the difficulty in accurately positioning and connecting multiple components in series, resulting in insufficient brightness and non-uniform spacing.
Innovation Solution
A method involving a rod with a winding control architecture and driving spindles is used to wind conducting wires with insulating layers, exposing contact-pad areas, where surface mounted light emitting components are straddled and connected using conductive paste, eliminating the need for individual soldering and ensuring accurate positioning and increased production efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If leads of semiconductor light emitting components are soldered to conducting wires, then electrical connection is achieved, but weld quality is difficult to control and components are prone to damage and separation
Solution Approach 1:
The invention extracts the soldering process entirely from the manufacturing method. Instead of soldering leads to conducting wires, the patent uses a wire wrapping technique where insulated conducting wires are wrapped around the leads and the insulation is removed at contact points to create electrical connection. This eliminates the complex soldering step while maintaining reliable electrical connection.
Solution Approach 2:
The insulating layer of the conducting wire acts as an intermediary that protects the connection. The wire is wrapped with insulation, and the insulation is selectively removed only at the contact-pad areas where electrical connection is needed. This intermediary protective layer prevents damage and separation while enabling reliable connection.
2Illumination intensity
If multiple semiconductor light emitting components are connected in series to increase brightness, then brightness is improved, but the manufacturing process becomes repetitive and production rate decreases
Solution Approach 1:
The invention merges multiple connection operations into a single integrated wire wrapping process. Multiple conducting wires are wrapped around multiple leads simultaneously, and the insulation is removed in one operation to expose multiple contact-pad areas. This combines what would otherwise be repetitive individual soldering operations into a single efficient manufacturing step.
Solution Approach 2:
The conducting wires are prepared with insulating layers before the actual connection process. The insulation is designed to be removed selectively during the wrapping process, preparing the connection interfaces in advance. This preliminary preparation of the wires with insulation allows for efficient batch processing of multiple components.
3Illumination intensity
If multiple semiconductor light emitting components are connected in series, then brightness is increased, but accurate positioning of components becomes difficult and spacing becomes non-uniform
Solution Approach 1:
The wire wrapping process is self-positioning. The conducting wire naturally wraps around the lead in a controlled manner, and the insulation removal creates contact-pad areas that automatically align with the wire wrap position. This self-service mechanism ensures uniform spacing and accurate positioning without requiring complex external positioning fixtures or manual alignment.
Solution Approach 2:
The wire wrapping technique uses the natural curvature and flexibility of the conducting wire to achieve precise positioning. The wire wraps around the cylindrical lead in a consistent spiral or loop pattern, creating uniform spacing between components. The curved wrapping path naturally distributes components evenly along the conducting wire, ensuring manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the manufacturing process, enhances production efficiency, improves reliability by providing stable connections, and ensures uniform spacing of components, reducing the risk of damage and separation, while maintaining brightness through precise electrical connections.
Implementation Method 1
Each lead of the surface mounted light emitting components is respectively positioned corresponding to the contact-pad areas, and is electrically connected to the conductors by the conductive paste
Data Source
AI summary
A method for manufacturing a light set with surface mounted light emitting components is disclosed. A rod having a predetermined length and a winding control architecture with corresponding driving spindles are prepared first. The rod is driven to rotate by a winding machine via driving spindles to wind conducting wires. The insulating layer of each conducting wire is then ground along an axial direction of the rod to expose the conductor of each conducting wire to form contact-pad area. A conductive paste is applied to each contact-pad area, and the surface mounted light emitting components are straddled thereon. Each lead of the surface mounted light emitting components is respectively positioned corresponding to the contact-pad areas, and is electrically connected to the conductors by the conductive paste. The contact-pad areas and the surface mounted light emitting component are then covered with a package.