SMD Light Source Placement Using Emission Characteristic Alignment

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Solution Overview

Problem

Existing methods for placing SMD semiconductor light source components in motor vehicle illumination devices lack precision, as they fail to accurately account for the light emission characteristics and intensity distribution, leading to suboptimal light reproduction and potential dazzling issues.

Innovation Solution

A method where SMD semiconductor light source components are operated to determine their emission characteristics, and then positioned and connected relative to other components based on these characteristics, allowing for precise alignment and compensation of light profiles, including intensity distribution, to achieve accurate light distribution and reproduction.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If SMD semiconductor light source components are placed using conventional methods without considering emission characteristics, then the placement process is simple and fast, but the light reproduction accuracy and positioning precision deteriorate

Engineering Contradiction:

Improveplacement precisionVSAvoidmethod complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The emission characteristics of the SMD semiconductor light source component are determined before the placement process. A light profile is created by operating the component and measuring its light emission, which is then used to guide the placement positioning, ensuring accurate light reproduction from the outset

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent replaces purely mechanical positioning methods with an optical measurement and evaluation system. By using optical sensors to detect the light emission characteristics and creating a light profile, the system substitutes mechanical trial-and-error placement with optically-guided precise positioning

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If the position of SMD semiconductor light source components is precisely defined and statically secured relative to a reflector, then the cut-off line can be safely maintained, but the complexity of ensuring precise positioning increases

Engineering Contradiction:

Improvesafety of cut-off lineVSAvoidpositioning system complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent implements a feedback mechanism where the emission characteristics of the placed component are measured and evaluated. The light profile created from these measurements provides feedback on whether the component is correctly positioned, allowing for verification that the cut-off line safety requirements are met

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

By determining emission characteristics before placement and creating a light profile in advance, the system prepares the positioning criteria beforehand. This preliminary action ensures that when the component is placed and secured, the safety requirements for the cut-off line are already built into the positioning methodology

Inventive Principle:

Principle #10Preliminary action

3Reliability

If SMD components are subjected to reflow soldering, then electrical connection is achieved, but the components become blurred causing disturbance in placement accuracy

Engineering Contradiction:

Improveelectrical connectionVSAvoidplacement accuracy

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The emission characteristics are determined and the light profile is created before the reflow soldering process. By establishing the optical reference data in advance, the system can compensate for any blurring that occurs during soldering, as the placement positioning is based on pre-measured characteristics rather than post-soldering appearance

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent replaces visual inspection and mechanical alignment methods with optical measurement and evaluation. By using the light profile created from optical measurements, the system substitutes mechanical positioning based on physical appearance with optically-guided positioning based on emission characteristics, making the process insensitive to visual blurring from soldering

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach ensures more precise placement and connection of SMD components, resulting in improved light reproduction and safety by accurately accounting for the light emission characteristics, reducing the risk of dazzling and enhancing the overall illumination performance.

Implementation Method 1

The SMD semiconductor light source component is operated so as to generate light

Methodology Applied

Scientific EffectElectroluminescence: Electroluminescence

Data Source

PatentUS10631414B2Method for placing an SMD semiconductor light source component of an illumination device for a motor vehicle

Publication Date: 2020.04.21 MARELLI GERMANY GMBH

AI summary

A method for placing an SMD semiconductor light source component and a component of an illumination device for a motor vehicle. The SMD semiconductor light source component is operated so as to generate light, and the emission characteristics of the SMD semiconductor light source component are determined. In a subsequent step, the SMD semiconductor light source component and the component are positioned relative to one another in accordance with the emission characteristics.