Surface Mount Component Recesses Prevent Solder Short Circuits
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Solution Overview
Problem
Surface mountable electronic components face the risk of short circuits due to excess solder contacting non-insulated side surfaces during soldering, which is challenging to prevent without increasing spacing or adding insulation layers, and existing solutions are costly and effort-intensive.
Innovation Solution
The introduction of recesses at the edges of the component's underside, covered with an insulating layer, effectively increases the spacing between connection areas and side surfaces, preventing solder contact and potential short circuits during soldering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connection areas are shifted from the edge towards the inside to prevent short circuits, then short circuit risk is reduced, but space utilization deteriorates and packing density decreases
Solution Approach 1:
The invention transitions from a two-dimensional planar arrangement to a three-dimensional structure by forming recesses (trenches) that extend vertically into the substrate. This vertical dimension creates additional spacing between connection areas and side surfaces without reducing the horizontal footprint, thereby maintaining packing density while preventing short circuits.
Solution Approach 2:
The substrate is segmented by forming recesses that divide the space between connection areas and side surfaces. These recesses create distinct spatial zones that prevent solder from bridging between conductive elements, effectively segmenting the potential short circuit paths while preserving the overall compact layout.
2Reliability
If additional layers (thick metallized layers and/or insulation layers) are provided to increase spacing, then short circuit prevention is improved, but manufacturing complexity and cost increase
Solution Approach 1:
Instead of providing insulation layers across the entire component surface, the invention applies insulation locally only within the recesses. This localized approach provides the necessary electrical isolation precisely where needed (at the boundaries between connection areas and side surfaces) while minimizing additional manufacturing steps and material usage.
Solution Approach 2:
The recesses are formed in the substrate before the final insulation and connection area formation steps. This preliminary structuring of the substrate creates the spacing geometry early in the manufacturing process, allowing subsequent layers to be deposited more simply without requiring additional thick metallized or insulation layers.
3Area of stationary object
If connection areas are kept close to the edge for high packing density, then space utilization is improved, but the risk of solder contact with side surfaces increases
Solution Approach 1:
The invention uses the vertical dimension (depth of recesses) to create spacing between connection areas and side surfaces, allowing horizontal proximity (high packing density) while maintaining vertical separation. This enables connection areas to remain near the edges for high density while the recesses prevent solder from reaching the non-insulated side surfaces.
Solution Approach 2:
The recesses act as intermediary structures between the connection areas and the side surfaces. These recesses, particularly when filled with or lined with insulating material, serve as a mediating barrier that allows the connection areas to be positioned close to the edges for high packing density while preventing the harmful effect of solder contact with the non-insulated side surfaces.
Data Source
AI summary
A surface mountable electronic component free of connecting wires comprises a semiconductor substrate, wherein a plurality of solderable connection areas are arranged at the underside of the component. The component comprises at least one recess is formed in the region of the edges bounding the underside; and in that the recess is covered with an insulating layer. A method for the manufacture of such a component comprises the formation of corresponding recesses.