SMD Resistor Manufacturing with Heat-Dissipating Layer

The patent applies composite materials by combining a resin layer with a metal foil layer to form a laminated structure. The resin layer provides mechanical strength and structural support, while the metal foil layer with serpentine pattern provides the desired resistance value. This composite structure allows the resistor to achieve high resistance through the serpentine path without compromising structural integrity, as the resin backbone maintains strength even when the metal layer is thin or highly patterned.

The patent removes the heat-trapping coating layers from the opposite surfaces of the resistor main body. Instead of covering the surfaces with protective coatings that impede heat dissipation, the design exposes the surfaces to allow efficient heat dissipation to the environment. The protection function is achieved through the inherent properties of the resin and metal foil composite structure, which provides mechanical protection without thermal insulation, thus resolving the contradiction between protection and heat dissipation.

The patent employs cost-effective materials by using standard resin and metal foil materials instead of expensive heat-resistant coating materials. The resin layer inherently provides sufficient thermal management and mechanical protection, eliminating the need for additional costly heat-resistant coatings. This approach maintains adequate heat resistance for typical resistor applications while significantly reducing material costs and manufacturing complexity.