SMD Soldering Barrier for Stable Placement on Molten Solder Paste
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Solution Overview
Problem
Existing methods for positionally stable soldering of SMD components are inadequate when overprinting is not possible due to adjacent components or fixed solder pads, leading to potential solder joint defects and misalignment during the soldering process.
Innovation Solution
A method involving a circuit carrier with solder paste-coated substrate contact surfaces and non-wettable vias, combined with adhesive points that form barriers to limit component movement, allowing for horizontal positioning and vertical sinking during soldering, preventing blurring and ensuring a homogeneous solder joint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If adhesive points are used to fix the SMD component before soldering, then component shifting is prevented, but solder joint defects occur due to insufficient solder material
Solution Approach 1:
The adhesive point is applied and cured before soldering to establish a barrier that prevents component shifting during the soldering process, while still allowing sufficient solder material to be present for a quality joint
2Quantity of substance
If excess solder is applied to compensate for volume loss, then adequate solder is available at the joint, but adjacent components prevent overprinting
Solution Approach 1:
The adhesive point creates a localized barrier effect that confines solder material to the specific contact area, eliminating the need for global excess solder application and enabling precise solder material control even with restricted overprinting
3Stability of the object's composition
If the component is fixed in position before soldering, then horizontal shifting is prevented, but vertical sinking is restricted causing defective solder joints
Solution Approach 1:
The adhesive point provides dynamic constraint that prevents horizontal shifting while allowing vertical sinking during soldering, creating a selective constraint system that adapts to different movement directions
4Stability of the object's composition
If adhesive points are applied to prevent shifting, then component stability is improved, but misalignment and blurring occur
Solution Approach 1:
The adhesive point is applied and cured before soldering to establish a barrier that prevents component shifting during the soldering process, while still allowing sufficient solder material to be present for a quality joint
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively prevents component shifting during soldering, ensuring a homogeneous solder joint free of voids and reducing misalignment issues, thus improving manufacturing efficiency and quality.
Implementation Method 1
a barrier is formed by means of the at least one adhesive point such that, firstly, a vertical sinking of the SMD component in the molten state of the solder paste is enabled, and secondly, a horizontal spreading of the SMD component on the molten solder paste in the direction of the barrier is mechanically limited by the barrier
Implementation Method 2
heating, melting and subsequent cooling of the solder paste to produce an electrical, thermal and/or mechanical connection
Implementation Method 3
heating, melting and subsequent cooling of the solder paste to produce an electrical, thermal and/or mechanical connection
Implementation Method 4
waiting for a curing process of the at least one adhesive point for a predefinable time period t, optionally at a predefinable temperature T
Implementation Method 5
heating, melting and subsequent cooling of the solder paste
Data Source
Figure 1a~1b
Figure 2a~2d
Figure 3a~3d
AI summary
The invention relates to a method for soldering an SMD component (1) to a circuit carrier (2) in a positionally stable manner, having the following steps: a) providing a circuit carrier (2) comprising at least one printed circuit board contact surface (2a) which is coated with a soldering paste (3) and which is designed to electrically, thermally, and/or mechanically contact the SMD component (1) to be connected, wherein a number of filled vias (6) which cannot be coated with molten solder pass through the circuit carrier (2) at least in the region of the printed circuit board contact surface (2a), b) applying at least one adhesive point (4a, 4b, 4c, 4d, 4e) onto the circuit carrier (2) such that the adhesive point (4a, 4b, 4c, 4d, 4e) delimits the printed circuit board contact surface (2a) coated with soldering paste (3) on at least one side of an edge point (Ra, Rb) paired with the soldering paste (3), c) placing an SMD component (1) which comprises at least one component contact surface (1a) on the printed circuit board contact surface (2a) coated with soldering paste (3) such that the at least one component contact surface (1a) electrically, thermally, and/or mechanically contacts the printed circuit board contact surface (2a) via the soldering paste (3) lying therebetween, said placement being carried out and the position of said at least one adhesive point (4a, 4b, 4c, 4d, 4e) being selected in step b) such that the SMD component (1) rests on the soldering paste (3) without contacting the at least one adhesive point (4a, 4b, 4c, 4d, 4e) , d) waiting for a specifiable duration t until a curing process of the at least one adhesive point (4a, 4b, 4c, 4d, 4e) is complete, and e) heating, melting, and subsequently cooling the soldering paste (3) in order to produce an electric, thermal, and/or mechanical connection between the at least one component contact surface (1a) of the SMD component (1) and the at least one printed circuit board contact surface (2a) of the circuit carrier (2). A barrier (5) is formed using the at least one adhesive point (4a, 4b, 4c, 4d, 4e) such that, first, the SMD component is allowed to vertically sink in the molten state of the soldering paste (3) and, second, the SMD component is mechanically restricted from drifting horizontally on the molten soldering paste (3) in the direction of the barrier (5) by means of the barrier (5).