SMD Standoff Interconnects for Semiconductor Package Mold Flow
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The yield and reliability of stacked semiconductor device packages, such as package on package (POP) or package in package (PIP), are compromised due to silicon interposers impeding mold flow of molding material.
Innovation Solution
A semiconductor device package design featuring surface mount device (SMD) components that act as both standoff and interconnection components between substrates, with connection electrodes electrically connecting the substrates without horizontal coupling, allowing for separate arrangement of discrete components that do not obstruct mold flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If silicon interposers are used to electrically connect substrates, then electrical connection between substrates is achieved, but mold flow of molding material is impeded
Solution Approach 1:
The patent extracts the electrical connection function from the silicon interposer and relocates it to SMD components positioned at the periphery of the substrates. This allows the central area to be free for mold flow while maintaining electrical connectivity through the extracted connection function at the edges.
Solution Approach 2:
The patent transitions from a planar connection approach to a three-dimensional stacked configuration. SMD components are positioned vertically between substrates, with connection electrodes extending in the vertical dimension, allowing mold flow to proceed horizontally without obstruction while electrical connections are established in the vertical dimension.
2Ease of manufacture
If discrete components are arranged separately between substrates, then manufacturing cost is reduced and mold flow is enabled, but electrical connection complexity increases
Solution Approach 1:
The SMD components perform multiple functions simultaneously: they provide electrical connection through their connection electrodes, act as standoffs to maintain substrate spacing, and serve as mounting platforms for additional components. This multi-functionality reduces the need for separate dedicated components, simplifying the overall structure despite the distributed arrangement.
Solution Approach 2:
The patent merges the electrical connection function, mechanical support function, and component mounting function into a single SMD component structure. The connection electrodes, insulating base, and standoff features are integrated into one component, reducing the total number of discrete parts needed while maintaining ease of manufacture.
Data Source
AI summary
A semiconductor device package includes a first substrate, a second substrate disposed over the first substrate, and a surface mount device (SMD) component disposed between the first substrate and the second substrate. The SMD component includes a plurality of connection electrodes electrically connecting the first substrate to the second substrate, and the plurality of connection electrodes are electrically disconnected from each other.