SMD Network Transformer Glue Frame Packaging for Coil Stability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for manufacturing network transformers face challenges in packaging coils, as they either loosen or are stressed by glue, leading to inductance value attenuation and conflicting production approaches that increase costs.
Innovation Solution
A manufacturing method for SMD network transformers involves creating a glue frame as an intermediate piece for packaging welding positions, allowing for convenient bonding and complete packaging of coils within the glue frame, which can be electroplated and molded in an integral structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the coil is packaged in glue material to prevent loosening, then the coil stability is improved, but the glue material stresses the magnetic ring causing inductance value attenuation
Solution Approach 1:
The patent divides the packaging process into two distinct stages: first packaging the welding position with glue material to fix the coil, then separately packaging the coil in a mold cavity. This segmentation allows the welding position to be secured without the magnetic ring being stressed by excessive glue material, thereby maintaining inductance value while preventing coil loosening.
Solution Approach 2:
The welding position is packaged with glue material in advance, before the coil is placed in the mold cavity. This preliminary action secures the welding position and prevents loosening, while the subsequent separate packaging of the coil in the mold cavity avoids stress on the magnetic ring, preserving the inductance value.
2Reliability
If the coil is not packaged in glue material to avoid stress on the magnetic ring, then the inductance value is maintained, but the coil may loosen
Solution Approach 1:
The patent separates the packaging of the welding position from the packaging of the coil. The welding position is packaged with glue material to prevent loosening, while the coil is packaged in a mold cavity without excessive glue material stressing the magnetic ring, thus maintaining inductance value.
Solution Approach 2:
The patent introduces a mold cavity as an intermediary structure for packaging the coil. The mold cavity provides a confined space that secures the coil without requiring excessive glue material that would stress the magnetic ring, thereby maintaining inductance value while preventing loosening.
3Reliability
If network transformers are manufactured separately to handle different packaging requirements, then product quality is maintained, but device cost increases
Solution Approach 1:
The patent combines two previously separate manufacturing processes into one integrated process. The welding position is packaged with glue material in the same mold cavity where the coil is subsequently packaged. This merging allows different packaging requirements to be satisfied simultaneously, maintaining product quality while reducing manufacturing cost and complexity.
Solution Approach 2:
The mold cavity serves multiple functions: it packages the welding position with glue material to prevent loosening, and simultaneously packages the coil without stressing the magnetic ring. This multi-functionality eliminates the need for separate manufacturing processes, reducing cost while maintaining product quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures that coils are securely fixed and packaged without being stressed by the glue, preventing inductance value attenuation, and allows for cost savings and improved production efficiency by integrating production processes and reducing the need for multiple production lines.
Implementation Method 1
packaging the welding positions through a glue material in an injection molding mode, the glue material forming a glue frame after the injection molding
Implementation Method 2
welding a wire end of the respective copper wire on a respective one of the plurality of metal PINs at a corresponding position to form a respective one of a plurality of welding positions
Implementation Method 3
The metal sheet is arranged so that all surfaces of the metal PIN can be electroplated during electroplating
Data Source
Figure 1
Figure 2
Figure 3
AI summary
A manufacturing method of an SMD network transformer is provided. which includes: taking a metal material sheet (100) and a plurality of coils (200), the metal material sheet including a substrate (110), metal PINs (120) and an auxiliary sheet (130), a left and/or right side end of the metal PINs being connected with the auxiliary sheet, a cross section of the metal PINs being exposed, the coil including a magnetic ring (210) and a copper wire (220), tapping the copper wires on the coils, and welding wire ends of the copper wires on the metal PINs to form welding positions (140); packaging the welding positions through a glue material, the glue material forming a glue frame (300), and the glue frame wrapping the welding positions; packaging the coils in the glue frame; and cutting the auxiliary sheet, taking down the substrate and the auxiliary sheet, and bending and shaping the metal PINs to form a product.