Switched-Mode Power Supply Using Bonding Wire Inductance
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Solution Overview
Problem
Conventional switched-mode power supplies (SMPS) require external inductors, which occupy large circuit areas and increase costs, making it challenging to integrate them into integrated circuits while maintaining efficiency and quality factors.
Innovation Solution
The SMPS employs bonding wires and lead frames as parasitic inductors to provide energy storage, utilizing current-controlled PWM and PFM modulators to operate at high frequencies, eliminating the need for external inductors and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If an external inductor is used in SMPS, then energy storage and power conversion efficiency are improved, but circuit area and cost increase
Solution Approach 1:
The invention extracts the inductor function from external components and integrates it into the IC chip itself. The internal inductor is fabricated directly within the chip, eliminating the need for separate external inductor components while maintaining the energy storage function necessary for power conversion efficiency.
Solution Approach 2:
The invention merges the inductor function with the IC chip structure by fabricating the inductor internally within the chip. This combines multiple functions (power management and energy storage) into a single integrated component, reducing overall circuit area while preserving power conversion efficiency.
2Area of stationary object
If inductor is fully integrated into IC, then circuit area is reduced, but inductance value and quality factor deteriorate
Solution Approach 1:
The invention applies local quality by optimizing the specific region where the internal inductor is fabricated within the IC chip. The inductor is placed in a dedicated area with optimized layout and structure to maximize its quality factor and inductance value while minimizing interference from surrounding circuit elements.
Solution Approach 2:
The invention employs dynamic compensation techniques where the internal inductor's performance is optimized through active control circuits that adjust operating parameters to maintain high quality factor across varying load conditions and frequencies.
3Reliability
If external inductor is used, then inductance value can be maintained, but device complexity and cost increase
Solution Approach 1:
The invention makes the IC chip universal by integrating multiple functions into a single device. The power management IC includes internal inductors, switching transistors, and control circuits all in one chip, eliminating the need for separate external inductor components and reducing overall system complexity.
Solution Approach 2:
The invention enables self-service by incorporating all necessary power conversion components including the inductor function directly within the IC chip. The chip serves itself by generating and storing the magnetic field internally without requiring external passive components, simplifying the overall system architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for high-frequency switching and cost reduction by utilizing parasitic inductance from bonding wires and lead frames, enabling efficient power conversion without the need for external inductors, suitable for both high and low load conditions.
Implementation Method 1
The SMPS employs bonding wires and lead frames as parasitic inductors to provide energy storage
Data Source
AI summary
A switched-mode power supply (SMPS) uses an equivalent inductor of bonding wire(s) and lead frame(s) to replace a traditional external inductor. A current-controlled pulse width modulation (PWM) modulator and a current-controlled pulse frequency modulation (PFM) modulator are optionally employed for high frequency switching, so as to mate a low inductance value of the bonding wire(s) and lead frame(s) and achieve reduced cost, low power consumption and low complexity.