SMT LED with Cup Leads Emulating TTW Optical Performance
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Solution Overview
Problem
Current light emitting devices using surface mount technology (SMT) lack the optical performance and potting capabilities of through the wave (TTW) devices, while TTW devices are cumbersome in manufacturing compared to SMT.
Innovation Solution
A surface mount technology device is designed to emulate the optical performance of TTW devices by using leads with cups to house light emitting diodes and a lens for encapsulation, and a manufacturing process that combines physical and electrical connections of lead frames to mimic TTW characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If surface mount technology (SMT) is used for light emitting devices, then manufacturing efficiency is improved, but optical performance and potting capabilities deteriorate
Solution Approach 1:
The patent merges the optical performance characteristics of TTW devices with the manufacturing advantages of SMT devices by combining SMT lead frame structure with TTW-style cup formations and lens encapsulation, creating a hybrid device that achieves both goals
Solution Approach 2:
The lead frame is designed to perform multiple functions: it provides mechanical support, electrical connections, and houses the light emitting element with proper optical encapsulation, making the SMT device universally capable of achieving TTW-level performance
2Reliability
If through the wave (TTW) soldering packages are used, then optical performance is improved, but manufacturing complexity increases
Solution Approach 1:
The patent combines the optical encapsulation structure of TTW devices with the simplified SMT manufacturing process, merging the benefits of both technologies into a single device that maintains optical performance while reducing manufacturing complexity
Solution Approach 2:
The device is segmented into distinct functional components (lead frame, cup formation, light emitting element, lens encapsulation) that can be manufactured and assembled using standard SMT processes, reducing overall manufacturing complexity
3Reliability
If through the wave (TTW) soldering packages are used, then potting capabilities are improved, but ease of manufacture deteriorates
Solution Approach 1:
The patent merges the potting capability of TTW devices with the ease of SMT manufacturing by designing the lead frame with integrated cup formations that can be potted using standard SMT potting processes
Solution Approach 2:
The cup formations are pre-formed on the lead frame during manufacturing, preparing the structure in advance for potting operations, which simplifies the subsequent potting process and improves ease of manufacture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting SMT device achieves the optical benefits of TTW devices with improved manufacturing efficiency, maintaining the structural integrity and performance of both technologies.
Implementation Method 1
A cup is formed on the first end of the first lead. The cup receives a light emitting device, which in some embodiments is a light emitting diode
Data Source
AI summary
Methods of making a light emitter are disclosed herein. An embodiment of a method comprises fabricating a line of first leads, the line of first leads comprising a plurality connected individual first leads; fabricating a line of second leads, the line of second leads comprising a plurality of connected individual second leads; physically connecting the line of first leads to the line of second leads, wherein a first individual first lead is adjacent a first individual second lead; attaching a light emitting device to the first individual first lead; electrically connecting the light emitting device to the first individual second lead; encapsulating a portion of the individual first lead and a portion of the individual second lead as a single unit; and separating the encapsulated first individual lead and the second individual lead from the first line of leads and the second line of leads.