SMT Package Substrate With Insulating Support for Short-Circuit Prevention
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Solution Overview
Problem
The increasing miniaturization of surface mount technology (SMT) substrates and components poses challenges in securing reliability, including foreign substance removal, void formation, and electrical short circuits, due to reduced distances between components and substrates.
Innovation Solution
The implementation of an SMT package with an SMT substrate featuring an interconnection layer, insulating layer, mask layer, and insulating supports that maintain a stable distance between the external electrode and the interconnection layer, using solder connections and strategically placed insulating supports to enhance electrical connectivity and prevent short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the SMT substrate and component are reduced in size, then the miniaturization is achieved, but the reliability of the package is compromised due to reduced distance between component and substrate
Solution Approach 1:
An insulating support structure is introduced as an intermediary element between the component's external electrode and the SMT substrate's interconnection layer. This insulating support maintains a controlled distance and provides mechanical support, preventing direct contact that could cause short circuits while enabling reliable solder connections. The insulating support acts as a mediator that resolves the conflict between miniaturization and reliability by allowing close proximity without direct contact.
2Length of stationary object
If the distance between component and substrate is reduced, then the package size is minimized, but the risk of electrical short circuits and void formation increases
Solution Approach 1:
The insulating support serves as a mediator that enables minimal distance while preventing harmful effects. It provides electrical isolation to prevent short circuits and maintains proper spacing to allow complete solder formation without voids. The insulating support structure includes regions that extend into the solder connection area to ensure proper solder wetting and connection while maintaining electrical isolation.
Solution Approach 2:
The insulating support structure exhibits local quality variations with different regions serving different functions: some regions provide mechanical support, others provide electrical isolation, and certain regions extend into the solder area to facilitate proper solder formation. This localized functional differentiation allows the structure to address multiple concerns (distance reduction, short circuit prevention, void prevention) simultaneously.
3Reliability
If insulating support is added to maintain distance, then the reliability is improved, but the device complexity increases
Solution Approach 1:
The insulating support structure is merged with the existing SMT substrate structure, integrating multiple functions into a unified component. The insulating support is formed as part of the substrate structure, combining mechanical support, electrical isolation, and solder connection facilitation into a single integrated element rather than separate components.
Solution Approach 2:
The insulating support structure performs multiple functions simultaneously: it provides mechanical support for the component, electrical isolation to prevent short circuits, controlled spacing for reliable solder connections, and guidance for solder formation. This multi-functionality reduces the need for additional separate structures, thereby limiting the increase in device complexity.
Data Source
AI summary
A surface mount technology (SMT) package includes an SMT substrate including an interconnection layer, an insulating layer having an arrangement region for the interconnection layer, and a mask layer on an upper surface of the insulating layer, a component including an insulating body, and an external electrode having at least a portion on a surface of the insulating body opposing the SMT substrate, and a solder that electrically connects the interconnection layer and the external electrode to each other. The mask layer has an opening, and the SMT substrate further includes an insulating support that supports the external electrode in the opening such that the external electrode is spaced apart from the interconnection layer and the insulating layer.