SMT Terminal Header with Insulative Housing for Compact HV Connections
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Solution Overview
Problem
Existing surface mount technology (SMT) terminal headers for high voltage (HV) applications are limited by the lack of power terminals, requiring multiple terminals for each connection, unsafe inter-terminal distances, and complex assembly due to large terminal heights, which restricts product volume and assembly efficiency.
Innovation Solution
A modular SMT terminal header with a reduced height and insulative housing featuring cells and fixation members, including position assurance nails, allows for precise HV connections by attaching conductive connector elements with a base for surface mount technology attachment, ensuring safe distances and facilitating assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If standard height terminals are used, then electrical connection is achieved, but inter-PCB distance increases and product volume cannot be reduced
Solution Approach 1:
The patent applies parameter changes by reducing the terminal height from standard dimensions to a optimized height that minimizes inter-PCB distance while maintaining electrical connection functionality. This parameter optimization directly addresses the contradiction by changing the dimensional parameter to achieve compact product volume without compromising the electrical connection capability.
2Power
If multiple terminals are used for each power connection, then high current flow is achieved, but safe distances between terminals cannot be ensured
Solution Approach 1:
The patent merges multiple terminal functions into a single integrated terminal structure. Instead of using multiple separate terminals for each power connection, the invention combines them into one unified terminal that provides both the required current flow capacity and maintains safe distances between different power connections, thereby resolving the contradiction between power capability and safety spacing.
Solution Approach 2:
The terminal structure is designed with multi-functionality to serve multiple purposes: it provides high current flow capacity for power connections, maintains safe insulation distances, and enables reliable electrical connection. This universal design allows a single terminal to fulfill multiple requirements that previously required multiple separate components.
3Ease of manufacture
If blind insertion of terminals is used, then PCB assembly is achieved, but assembly complexity increases due to large number of terminals
Solution Approach 1:
The patent merges multiple individual terminal operations into a single integrated terminal assembly that can be installed as one unit. This consolidation reduces the number of separate assembly steps required during blind insertion, thereby simplifying the manufacturing process while maintaining the necessary electrical connection functionality across multiple points.
Data Source
AI summary
A surface mount technology (SMT) terminal header is described for providing an electrical connection to a first printed circuit board (PCB). The SMT terminal header includes multiple first electrically conductive connector elements each having a base configured for surface mount attachment to the first PCB, and an insulative housing having multiple cells and a fixation member configured to attach the housing to the first PCB. Each of the multiple cells is configured to at least partially house one of the multiple first electrically conductive connector elements. Each of the first electrically conductive connector elements includes a position assurance member configured to attach the first electrically conductive connector element to at least one of the multiple cells of the insulative housing.