SMT-to-Through-Hole Adapter for Magnetic Module Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Magnetic components or electronic modules with surface mount technology (SMT) cannot be attached to host substrates with through holes, and those with through-hole pins cannot be used with SMT pads, requiring separate design and testing for different mounting types, increasing costs and time to market.
Innovation Solution
An adapter is provided that allows surface-mount magnetic components or electronic modules to be through-hole mounted, featuring a through-hole pin connected to an adapter housing with a spring arm for retention and a SMT end for engagement with SMT pads, enabling attachment to a host substrate with through holes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If surface mount technology (SMT) magnetic components or electronic modules are used, then the components can be attached to host substrates with SMT pads, but they cannot be attached to host substrates with through holes
Solution Approach 1:
An adapter is introduced as an intermediary component between the SMT magnetic component and the through-hole substrate. The adapter includes an adapter body with SMT pads for attaching the SMT component, and through-hole pins extending from the adapter body to insert into the substrate through holes. This intermediary structure enables SMT components to be mounted on through-hole substrates without modifying the component itself.
Solution Approach 2:
The mounting solution is segmented into three separate parts: the SMT magnetic component, the adapter, and the substrate. The adapter is designed as a separate component that bridges the incompatibility between SMT component packaging and through-hole mounting requirements, allowing each part to maintain its original design while achieving compatibility through the segmented architecture.
2Reliability
If separate design and testing are performed for SMT packages and through-hole packages, then each mounting type can be optimized, but the cost and time to market increase
Solution Approach 1:
The adapter enables a single SMT magnetic component design to serve multiple mounting types (both SMT and through-hole). By making the component universally mountable through the adapter interface, the need for separate SMT-optimized and through-hole-optimized package designs is eliminated, reducing development time while maintaining mounting reliability.
Solution Approach 2:
The adapter is designed and tested in advance as a standalone component. Once the adapter is validated, the same SMT magnetic component can be used with both SMT and through-hole substrates without requiring additional component-level design iterations or re-testing, thereby accelerating time to market while ensuring mounting reliability.
3Reliability
If separate design and testing are performed for SMT packages and through-hole packages, then each mounting type can be optimized, but the cost increases
Solution Approach 1:
A single SMT magnetic component design can be used with both SMT and through-hole substrates by employing the adapter, eliminating the need to manufacture two separate component variants. This universality reduces tooling costs, inventory complexity, and manufacturing setup costs while maintaining reliable mounting for both substrate types.
Solution Approach 2:
The adapter serves as a cost-effective intermediary that resolves mounting incompatibility without requiring expensive redesigns of the magnetic component itself. The adapter can be manufactured using standard PCB and connector techniques, making it more economical than redesigning the entire magnetic component for through-hole mounting.
Data Source
AI summary
An electronic module includes a substrate including a primary conductive pattern and a secondary conductive pattern; a magnetic core located on or above the substrate; a primary winding including a first portion that extends around at least a portion of the magnetic core and that is connected to the primary conductive pattern; a secondary winding including a second portion that extends around at least a portion of the magnetic core and that is connected to the secondary conductive pattern; an electronic component located on the substrate; and an adapter that is connected to the electronic module and that includes at least one through-hole pin configured to through-hole mount the electronic module.