Sn Solder Alloy Composition for Oxide Control and Wettability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Solder alloys with a principal ingredient of Sn face issues with discoloration and deteriorated wettability under high-temperature and high-humidity environments, despite additions of Ge and Mn, as existing technologies do not effectively inhibit oxide film growth and maintain fusion properties.
Innovation Solution
Adding predetermined amounts of Mn and Ge to the solder alloy, with Mn inhibiting the growth of Sn oxide and Ge providing a discolor-inhibiting effect, ensures the oxide film remains stable, preventing discoloration and improving fusion properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If Ge is added to the solder alloy to inhibit discoloration, then discoloration resistance is improved, but wettability deteriorates
Solution Approach 1:
The patent combines Ge and Mn in specific proportions (Ge: 0.001-0.1 mass%, Mn: 0.005-0.1 mass%) to achieve synergistic effects where Ge provides discoloration resistance and Mn provides wettability, resolving the contradiction between these two properties
Solution Approach 2:
The patent optimizes the concentration parameters of Ge and Mn within specific ranges to balance discoloration resistance and wettability, demonstrating that precise parameter control can resolve property contradictions
2Object-affected harmful factors
If Mn is added to the solder alloy to improve wettability, then wettability is improved, but discoloration resistance deteriorates
Solution Approach 1:
The patent combines Ge and Mn in specific proportions (Ge: 0.001-0.1 mass%, Mn: 0.005-0.1 mass%) to achieve synergistic effects where Ge provides discoloration resistance and Mn provides wettability, resolving the contradiction between these two properties
Solution Approach 2:
The patent optimizes the concentration parameters of Ge and Mn within specific ranges to balance discoloration resistance and wettability, demonstrating that precise parameter control can resolve property contradictions
3Reliability
If strict management on storage conditions is performed to inhibit oxide film growth, then oxide film growth is inhibited, but manufacturing complexity increases
Solution Approach 1:
The solder alloy composition itself provides oxide film inhibition through the Ge and Mn additives, making the material self-protecting against oxidation without requiring external storage condition control
Solution Approach 2:
The patent changes the chemical composition parameters of the solder alloy by adding specific amounts of Ge and Mn, which fundamentally alters the oxidation behavior and eliminates the need for strict storage management
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The combination of Mn and Ge in the solder alloy effectively inhibits discoloration and maintains wettability even under harsh environmental conditions, enhancing the solder's fusion properties and preventing defects in soldering.
Implementation Method 1
Mn inhibiting the growth of Sn oxide
Implementation Method 2
Ge providing a discolor-inhibiting effect
Data Source
AI summary
A solder alloy that contains 0.005 mass % or more and 0.1 mass % or less of Mn, 0.001 mass % or more and 0.1 mass % or less of Ge, and a balance of Sn. A plurality of Ge oxides is distributed on an outermost surface side of an oxide film including Sn oxide, Mn oxide and Ge oxide by adding 0.005 mass % or more and 0.1 mass % or less of Mn, 0.001 mass % or more and 0.1 mass % or less of Ge to the solder alloy having a principal ingredient of Sn, so that it is possible to obtain the discolor-inhibiting effect even under the high-temperature and high-humidity environment.