Snap-Cure Conductive Epoxy Adhesive for Flexible Solar Cell Bonding
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Solution Overview
Problem
Existing electrically conductive adhesives used in photovoltaic modules face challenges such as slow cure times, high cure temperatures, rigidity, and poor mechanical strength, which affect the efficiency and reliability of solar cell connections, particularly in shingle module structures.
Innovation Solution
A snap-cure electrically conductive epoxy adhesive composition comprising cycloaliphatic epoxide resin, vinyl ether, onium salt, radical initiator, electrically conductive particles, and organic solvent, which allows for fast curing at low temperatures and provides flexibility and high adhesion to metallization parts of silicon solar cells.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If conventional electrically conductive adhesives are used for bonding solar cells, then electrical conductivity is achieved, but cure time is excessive and cure temperature is too high
Solution Approach 1:
The patent modifies the chemical composition parameters of the adhesive by incorporating vinyl ether and onium salt into the epoxy system, which fundamentally changes the curing mechanism to enable rapid curing at lower temperatures. This parameter change transforms the curing kinetics without sacrificing electrical conductivity or adhesion properties.
Solution Approach 2:
The invention creates a composite adhesive system combining epoxy resin with vinyl ether and onium salt components, forming a multi-functional material that simultaneously provides structural adhesion, electrical conductivity, and rapid low-temperature curing capabilities that individual materials cannot achieve alone.
2Strength
If conventional conductive adhesives are used, then electrical connection is established, but the adhesive is too rigid and lacks mechanical strength
Solution Approach 1:
The patent adjusts the compositional parameters by incorporating flexible polymer components and optimizing the epoxy-to-plasticizer ratio, which changes the viscoelastic parameters of the cured adhesive. This enables the material to maintain high mechanical strength while possessing the flexibility needed to accommodate thermal expansion and contraction in photovoltaic applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves rapid curing within 10-60 seconds at 120-200°C, offering low electrical contact resistance, high flexibility, and strong adhesion, enhancing the mechanical stability and efficiency of solar cell connections in shingle module photovoltaic applications.
Implementation Method 1
The composition comprises a cycloaliphatic epoxide resin, a vinyl ether, an onium salt, and a radical initiator, which enables snap-cure through photopolymerisation at 120-200°C within 10-60 seconds
Implementation Method 2
The composition comprises 45 to 85% by weight of electrically conductive particles, providing low electrical contact resistance and high conductivity for electrical interconnection
Data Source
AI summary
The present invention relates to an electrically conductive composition comprising a) from 5 to 25% by weight of the total weight of the composition of a cycloaliphatic epoxide resin; b) from 0.05 to 10% by weight of the total weight of the composition of a vinyl ether; c) from 0.1 to 0.45% by weight of the total weight of the composition of an onium salt; d) from 0.01 to 10% by weight of the total weight of the composition of a radical initiator; e) from 45 to 85% by weight of the total weight of the composition of electrically conductive particles; and f) from 0.1 to 10% by weight of the total weight of the composition of an organic solvent. The composition can be used as an adhesive in the electronic applications, especially as an adhesive in the shingle module photovoltaic applications.