Snap-RF Interconnections Using Magnetic Coupling
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Solution Overview
Problem
Conventional PCB manufacturing processes for RF and electromagnetic circuits are costly, time-consuming, and limited in supporting high-frequency signals due to bulky connectors and large feature sizes, which restrict the range of frequencies that can be handled.
Innovation Solution
A radio frequency interconnect structure using magnetic coupling between substrates with conductive and ground planes, employing additive and subtractive manufacturing techniques to create low-profile, compact interconnections with Faraday walls for signal isolation and alignment, allowing for smaller dimensions and higher frequency support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional PCB manufacturing processes are used, then manufacturing cost and time increase, but manufacturing precision and feature size capability remain limited
Solution Approach 1:
The manufacturing process is divided into discrete steps: drilling holes through the substrate, depositing conductive material in the holes to form vias, and depositing conductive ink on the surface to form ground boundaries. This segmentation allows each step to be optimized independently, achieving high precision small feature sizes while maintaining ease of manufacture using standard PCB processes.
Solution Approach 2:
The invention transitions from planar ground boundaries to three-dimensional structures by drilling holes through the substrate and depositing conductive material vertically. This adds the depth dimension, enabling electrically continuous ground boundaries that extend through the entire substrate thickness, which improves signal integrity at high frequencies while using simple manufacturing steps.
2Reliability
If conventional connectors are used for interconnection, then connection reliability is achieved, but the connectors become bulky and lossy with limited frequency range
Solution Approach 1:
The invention extracts the essential function of electrical connection from bulky conventional connectors and implements it directly through the substrate using drilled holes filled with conductive material. This removes the need for separate connector components, achieving reliable electrical connection with minimal volume and reduced signal loss.
Solution Approach 2:
The conductive material deposited in the drilled holes acts as an intermediary that provides both mechanical alignment and electrical connection between mating substrates. This intermediary structure replaces conventional connectors, enabling reliable connection with much smaller dimensions and better high-frequency performance.
3Productivity
If conventional PCB processes are used, then manufacturing is straightforward, but turnaround time and cost increase due to multiple steps and iterations
Solution Approach 1:
The ground boundaries and signal traces are deposited as preliminary structures before final assembly. The conductive material is pre-deposited in holes and on surfaces, creating ready-to-connect interfaces that eliminate the need for complex final assembly steps and reduce manufacturing cycle time.
Solution Approach 2:
The invention changes the manufacturing parameters by using direct deposition methods instead of traditional multi-step lamination and etching processes. This allows for faster production with fewer iterations, reducing both turnaround time and manufacturing cost while maintaining high precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables reliable, low-cost, low-profile interconnections suitable for higher frequencies, reducing manufacturing costs and cycle times while supporting smaller dimensions and improved signal integrity.
Implementation Method 1
A radio frequency interconnect structure using magnetic coupling between substrates with conductive and ground planes
Implementation Method 2
a magnetic element configured to align the first contact point of the first connector and the second contact point of the second connector and secure mated contact between the contact points
Data Source
Figure 1~2
Figure 3~3B
Figure 4~5A
AI summary
A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.