Snubber Circuit Module Integration in Semiconductor Modules
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional snubber circuits connected to semiconductor modules have high contact resistance and inductance, leading to ineffective suppression of surge voltages, necessitating increased capacity and closer integration with semiconductor elements.
Innovation Solution
A semiconductor module design featuring a snubber-circuit-connecting opening on its outer surface, allowing for the attachment of a snubber circuit module with electrodes that minimize length and maximize surface contact, reducing inductance and contact resistance, thereby enhancing surge voltage suppression.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional screw clamping or pin contacts are used to connect the snubber circuit, then the connection is established, but the contact resistance and inductance are high, reducing the effectiveness of surge voltage suppression
Solution Approach 1:
The snubber circuit module is integrated directly into the semiconductor module housing, merging two previously separate components into a unified structure. This integration eliminates the need for external screw clamping or pin contacts, thereby reducing contact resistance and inductance while improving surge voltage suppression effectiveness.
Solution Approach 2:
The snubber circuit module is nested within the semiconductor module housing, with the snubber circuit module fitting into a dedicated space inside the housing. This nesting arrangement allows for close proximity connection between the snubber circuit and semiconductor elements, minimizing connection length and reducing inductance.
2Reliability
If the snubber circuit is connected to exposed terminals on the package outer surface, then the connection is established, but the connection length is increased, resulting in higher inductance and reduced suppression effectiveness
Solution Approach 1:
The snubber circuit module is extracted from the external connection approach and repositioned to be integrated within the semiconductor module housing. This extraction from the external terminal connection method reduces the connection length by placing the snubber circuit closer to the semiconductor elements.
Solution Approach 2:
The connection approach transitions from external surface mounting to internal integration along a different spatial dimension. The snubber circuit module is positioned inside the housing, utilizing the internal volume to achieve shorter connection paths between the snubber circuit and semiconductor elements.
3Object-affected harmful factors
If the snubber circuit module is integrated within the semiconductor module housing, then the inductance and contact resistance are reduced, but the housing structure must accommodate the additional internal component
Solution Approach 1:
The housing structure is designed to serve multiple functions: it encloses the semiconductor elements, provides mechanical support, and accommodates the snubber circuit module. This multi-functionality approach integrates the housing as both a protective enclosure and a mounting structure for the snubber circuit, avoiding the need for additional separate mounting components.
Data Source
AI summary
In a semiconductor module, at least one snubber circuit module is attachable/detachable to/from an interior communicated with a snubber-circuit-connecting opening; a plurality of snubber-circuit electrodes for electrically connecting with the at least one snubber circuit module are joined with a circuit pattern; the plurality of snubber-circuit electrodes are disposed in the interior of the snubber-circuit-connecting opening; in a state that the snubber circuit module is attached in the interior of the snubber-circuit-connecting opening, the snubber circuit module does not stick out from an outer surface of an outer enclosure member, the plurality of snubber-circuit electrodes are in surface-contact with electrodes in the side of the snubber circuit module, respectively; and the snubber-circuit-connecting opening and the interior are not overlapped with the at least one semiconductor element in a planar view.