Silicon-Assisted SOA Array Packaging for Compact FMCW LiDAR

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Solution Overview

Problem

Conventional LiDAR systems are bulky, costly, and unreliable due to the use of mechanical moving parts and bulk optical lens elements, making them unsuitable for applications like automotive LiDAR.

Innovation Solution

A photonic integrated circuit (PIC) assembly incorporating a semiconductor optical amplifier (SOA) array and a U-turn chip, which includes an optical splitter and waveguide assembly to steer laser beams without mechanical parts, facilitating integration and packaging with a PIC chip.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If mechanical moving parts and bulk optical lens elements are used for beam steering, then beam steering capability is achieved, but system size, cost, and reliability deteriorate

Engineering Contradiction:

Improvebeam steering capabilityVSAvoidsystem size

Core Design Contradiction:

Ease of operationVSVolume of moving object

Solution Approach 1:

The patent replaces mechanical moving parts and bulk optical lens elements with a photonic integrated circuit (PIC) assembly that uses waveguides and optical phase modulators to steer laser beams. This substitution eliminates mechanical components while maintaining beam steering capability through optical path control within the integrated circuit, directly resolving the contradiction between achieving beam steering and reducing system size.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Ease of operation

If mechanical moving parts and bulk optical lens elements are used for beam steering, then beam steering capability is achieved, but system cost and reliability deteriorate

Engineering Contradiction:

Improvebeam steering capabilityVSAvoidsystem reliability

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

The patent eliminates mechanical moving parts by using integrated photonic components including waveguides and optical phase modulators that control beam direction through electrical signals rather than mechanical movement. This substitution improves reliability by removing mechanical failure points while maintaining full beam steering functionality.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent integrates multiple optical functions (beam steering, amplification, splitting) into a single photonic integrated circuit assembly. By merging these functions into one compact unit rather than using separate mechanical components, the system achieves improved reliability and reduced cost while maintaining operational capability.

Inventive Principle:

Principle #5Merging (Combining)

3Ease of operation

If conventional LiDAR components are used, then beam steering is achieved, but manufacturing cost and system complexity increase

Engineering Contradiction:

Improvebeam steering functionVSAvoidmanufacturing cost

Core Design Contradiction:

Ease of operationVSEase of manufacture

Solution Approach 1:

The patent combines beam steering, optical amplification, and light splitting functions into a single integrated photonic circuit assembly. This merging of functions reduces the number of discrete components needed, simplifies manufacturing processes, and lowers overall system cost while maintaining full beam steering functionality.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The photonic integrated circuit assembly performs multiple functions (beam steering via waveguide routing, amplification via SOAs, and splitting via optical splitters) within a single device. This multi-functionality eliminates the need for separate mechanical components, reducing both manufacturing cost and system complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The PIC assembly enables efficient and reliable LiDAR operation by providing a compact, cost-effective solution for beam steering, allowing for accurate range and velocity measurements using frequency modulated continuous wave (FMCW) LiDAR systems.

Implementation Method 1

The input SOA and the plurality of SOAs are arranged parallel to one another... each of the plurality of SOAs are configured to amplify their respective beams to generate a plurality of amplified output beams

Methodology Applied

Scientific EffectStimulated emission: Light

Implementation Method 2

The optical splitter is configured to receive amplified input light propagating in a first direction from the input SOA, and divide the amplified light into a plurality of beams

Methodology Applied

Scientific EffectOptical splitting: Reflection

Implementation Method 3

The waveguide assembly is configured to guide each of the plurality of beams to a corresponding SOA of the plurality of SOAs. The waveguide assembly also adjusts a direction of propagation of each of the guided beams

Methodology Applied

Scientific EffectTotal internal reflection: Total Internal Reflection

Data Source

PatentEP4718132A2Silicon-assisted packaging of high power integrated SOA array

Publication Date: 2026.04.01 AURORA OPERATIONS INC

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AI summary

One aspect of the present disclosure relates to a light detection and ranging (LiDAR) system, the LiDAR system comprising a semiconductor optical amplifier, SOA, module which comprises an SOA chip, wherein the SOA chip includes a front facet and a back facet that is opposite the front facet. The SOA module further comprises a carrier onto which the SOA chip is bonded; and a U-turn chip coupled to the SOA chip with a shim, the shim configured to provide a mechanical offset between the U-turn chip and the carrier.