SOA Array U-Turn Chip Packaging for Compact FMCW LiDAR

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Solution Overview

Problem

Conventional LiDAR systems are bulky, costly, and unreliable due to their use of mechanical moving parts and bulk optical lens elements, which limits their effectiveness in applications such as automotive systems.

Innovation Solution

A photonic integrated circuit (PIC) assembly incorporating a semiconductor optical amplifier (SOA) array and a U-turn chip, where the SOA array includes an input SOA and multiple SOAs arranged parallel to each other, and the U-turn chip features an optical splitter and waveguide assembly to divide and redirect amplified light for efficient beam amplification, facilitating the integration and packaging of the SOA module with the PIC chip in a frequency modulated continuous wave (FMCW) LiDAR system.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional LiDAR systems use mechanical moving parts and bulk optical lens elements, then beam steering and focusing can be achieved, but the systems become bulky, costly, and unreliable

Engineering Contradiction:

Improvesystem reliabilityVSAvoidmechanical moving parts and bulk optical elements

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces mechanical moving parts with a photonic integrated circuit that uses optical phase modulators to electronically control beam direction. The bulk optical lens elements are replaced with planar photonic components including waveguides and grating structures that achieve beam steering and focusing without mechanical movement, thereby improving reliability while reducing device complexity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent integrates multiple previously separate components into a single photonic integrated circuit chip. The laser source, optical modulators, beam steering elements, and detection components are merged onto one chip, eliminating the need for separate mechanical assemblies and bulk optical elements, thus reducing both device complexity and improving system reliability.

Inventive Principle:

Principle #5Merging (Combining)

2Adaptability or versatility

If conventional LiDAR systems use mechanical moving parts and bulk optical lens elements, then beam steering can be achieved, but the systems become bulky and costly

Engineering Contradiction:

Improvebeam steering capabilityVSAvoidsystem size and weight

Core Design Contradiction:

Adaptability or versatilityVSWeight of stationary object

Solution Approach 1:

The patent replaces mechanical beam steering mechanisms with a photonic integrated circuit that uses optical phase modulators and grating structures to electronically control beam direction. This substitution eliminates heavy mechanical components while maintaining full beam steering capability, significantly reducing system weight and size.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent transitions from three-dimensional bulk optical elements to two-dimensional planar photonic structures on a chip. The beam steering function is achieved through phase modulation in the optical domain rather than mechanical movement in physical space, enabling compact integration while preserving adaptability.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The PIC assembly enables compact, reliable, and cost-effective LiDAR systems by eliminating the need for bulk optical lens elements and mechanical moving parts, allowing for direct measurement of range and velocity through frequency modulation, while improving manufacturing efficiency and reducing packaging complexities.

Implementation Method 1

Each of the plurality of SOAs are configured to amplify their respective beams to generate a plurality of amplified output beams

Methodology Applied

Scientific EffectStimulated emission: Light

Implementation Method 2

The optical splitter is configured to receive amplified input light propagating in a first direction from the input SOA, and divide the amplified light into a plurality of beams

Methodology Applied

Scientific EffectOptical beam splitting: Dispersion (of waves)

Implementation Method 3

The waveguide assembly is configured to guide each of the plurality of beams to a corresponding SOA of the plurality of SOAs. The waveguide assembly also adjusts a direction of propagation of each of the guided beams

Methodology Applied

Scientific EffectTotal internal reflection: Total Internal Reflection

Data Source

PatentUS12199411B2Silicon-assisted packaging of high power integrated SOA array

Publication Date: 2025.01.14 AURORA OPERATIONS INC

AI summary

A photonic integrated circuit (PIC) assembly comprising a semiconductor optical amplifier (SOA) array and a U-turn chip. The SOA array includes an input SOA and a plurality of SOAs. The input SOA and the plurality of SOAs are arranged parallel to one another. The U-turn chip includes an optical splitter and a waveguide assembly. The optical splitter is configured to receive amplified input light propagating in a first direction from the input SOA, and divide the amplified light into beams. The waveguide assembly guides the beams to a corresponding SOA of the plurality of SOAs, and adjusts a direction of prorogation of each of the guided beams to be substantially parallel to a second direction that is substantially opposite the first direction.