SOA Over-Temperature Circuit for Fast Power Shutdown

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Solution Overview

Problem

Existing over-temperature protection systems for power semiconductor devices face challenges such as localized temperature sensing leading to false triggers and increased IC size, or delayed detection resulting in irreversible device damage, and existing complex solutions like dynamic power dissipation modeling are inefficient.

Innovation Solution

Implementing a safe operating area (SOA)-based protection circuit that independently monitors power dissipation using a combination of temperature and current sensing, with a dual-path current mirror and Schmidt triggers to quickly shut down the device when power exceeds a threshold, ensuring rapid and accurate over-temperature detection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the OT sensor is located inside the guard ring around the switching element, then the sensor can detect localised high temperature regions quickly, but this reduces the active driver area resulting in a larger IC and higher ON-state resistance

Engineering Contradiction:
Improvetemperature detection accuracyVSAvoidactive driver area
Core Design Contradiction:
Measurement precisionVSArea of stationary object

Solution Approach 1:

The patent transitions from planar 2D temperature sensing to 3D temperature sensing by placing the OT sensor vertically above the switching element through multiple semiconductor layers. This vertical dimension allows the sensor to monitor temperature at the switching element location without consuming horizontal active driver area, thus resolving the contradiction between detection accuracy and available area.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If the OT sensor is placed inside the guard ring, then temperature detection is immediate, but the IC size increases and ON-state resistance increases

Engineering Contradiction:
Improveover-temperature protection reliabilityVSAvoidIC structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The OT sensor is nested within the vertical stack of semiconductor layers, specifically positioned above the switching element and integrated within the guard ring structure. This nesting approach allows the sensor to be embedded in the existing device architecture without adding lateral complexity or increasing IC footprint, while maintaining reliable temperature monitoring.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Area of stationary object

If the OT sensor is placed outside the guard ring, then the active driver area is preserved, but there is a time delay in detecting over-temperature conditions

Engineering Contradiction:
Improveactive driver areaVSAvoidtemperature detection time
Core Design Contradiction:
Area of stationary objectVSLoss of time

Solution Approach 1:

By utilizing the vertical dimension through multiple semiconductor layers, the sensor achieves proximity to the switching element for immediate temperature detection while the horizontal footprint remains minimal, preserving active driver area. The vertical integration path allows rapid thermal coupling without lateral space constraints.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

4Reliability

If a complex dynamic power dissipation modeling approach is used, then safe operating area protection is achieved, but the solution becomes complex and inefficient

Engineering Contradiction:
Improvesafe operating area protectionVSAvoidprotection circuit complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts the temperature sensing function from complex power dissipation modeling and mathematical thermal behavior analysis, implementing instead a direct physical temperature sensor that measures actual temperature. This extraction simplifies the protection mechanism from complex calculations to direct physical measurement, reducing circuit complexity while maintaining reliable safe operating area protection.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The SOA-based protection circuit effectively prevents irreversible damage by quickly shutting down the device, maintaining it within safe operating limits, reducing IC size, and avoiding false triggers, thus enhancing reliability and efficiency.

Implementation Method 1

a temperature sensor (9) integrated within the driver (7) and in thermal contact with the switching element (8)

Methodology Applied
Scientific EffectThermal contact: Conduction (thermal)

Implementation Method 2

The over-temperature protection circuit comprises a temperature sensor, a Schmidt trigger, a first resistor and a second resistor

Methodology Applied
Scientific EffectHysteresis: Hysteresis

Data Source

PatentEP3744003B1Over-temperature protection circuit
Publication Date: 2025.07.16 RENESAS ELECTRONICS CORP
  • EP3744003B1 patent drawingFigure 1
  • EP3744003B1 patent drawingFigure 2
  • EP3744003B1 patent drawingFigure 3

AI summary

An over-temperature protection circuit (11) is described. The circuit comprises an input (13) for sensing a voltage (VDS) across a transistor, a voltage-to-current converter (15) configured to generate a current (Isense_in) in dependence upon the voltage, an accumulator (CSOA) storing a value indicative of power dissipated by the transistor and which depends on the current; and a comparator (R, 45, 46) configured to determine whether the value exceeds a threshold value and, in dependence on the value exceeding the threshold value, to generate a signal (SOA_SD) to cause the transistor to be switched off.