SoC Process-Aware Boot-Up for Lower XR Skin Temperature
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Solution Overview
Problem
Extended reality (XR) devices, such as AR and VR headsets, face challenges with power-intensive computational tasks during boot-up, leading to increased skin temperature and discomfort due to static SoC voting across all parts, which results in higher power consumption and temperature for higher-leakage parts.
Innovation Solution
Implementing part-based process-aware boot-up techniques that consider open loop voltage and quiescent current fuses to evaluate power-range and use a look-up table to map to appropriate CPU votes, reducing power consumption and skin temperature through dynamic voltage selection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If static SoC voting is used across all parts during boot-up, then device simplicity is maintained, but power consumption and skin temperature increase for higher-leakage parts
Solution Approach 1:
The patent applies local quality by transitioning from uniform static voting to part-specific dynamic voting during boot-up. Each part of the SoC is evaluated individually based on its leakage characteristics, and voting results are customized per part rather than applied uniformly across all parts. This localized approach reduces power consumption for higher-leakage parts while maintaining appropriate operation for lower-leakage parts.
Solution Approach 2:
The patent implements dynamics by changing from static voting to dynamic voting during boot-up. The voting process adapts to real-time conditions by evaluating each part's leakage characteristics and adjusting voltage/frequency settings accordingly. This dynamic adjustment allows the system to optimize power consumption based on actual part characteristics rather than using fixed predetermined settings.
2Device complexity
If static SoC voting is used across all parts during boot-up, then device simplicity is maintained, but skin temperature increases due to higher power consumption
Solution Approach 1:
The patent applies local quality by implementing part-specific voting results that account for individual part characteristics. Higher-leakage parts receive customized voltage and frequency settings that limit their power consumption and heat generation, while lower-leakage parts can operate at higher performance levels. This localized optimization directly addresses skin temperature concerns by reducing heat generation at specific high-leakage locations.
Solution Approach 2:
The patent implements dynamics by using dynamic voting during boot-up that adapts to each part's leakage characteristics. The system evaluates parts in real-time and adjusts operating parameters dynamically, allowing higher-leakage parts to operate at lower power/temperature levels while maintaining overall system functionality. This dynamic adjustment directly reduces skin temperature by preventing excessive heat generation during the critical boot-up phase.
3Use of energy by moving object
If part-based process-aware boot-up is implemented, then power consumption and skin temperature are reduced, but device complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the SoC into individual parts and evaluating each part's leakage characteristics separately during boot-up. Rather than treating the entire SoC as a single unit, the system segments the voting process into part-specific evaluations and applications. This segmentation enables targeted power optimization for each part while maintaining a manageable overall process through systematic evaluation and lookup table-based decision-making.
4Temperature
If part-based process-aware boot-up is implemented, then skin temperature is reduced, but device complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the SoC into individual parts and applying specific voting results to each part based on its leakage characteristics. This segmentation allows targeted temperature control for high-leakage parts that contribute most to skin temperature, while avoiding unnecessary complexity for parts that don't require special attention. The systematic part-by-part evaluation and application process manages complexity through structured procedures.
Data Source
AI summary
This disclosure provides methods, components, devices and systems for process-aware boot-up. An example method, performed at a system-on-a-chip (SoC), generally includes obtaining parameters associated with estimated boot-up power consumption for different parts of the SoC, and setting at least one of operating voltages or operating frequencies for the different parts during a boot-up procedure, based on the corresponding parameters.