SoC Camera Optical Stack for Multi-Sensor Light Integration
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Solution Overview
Problem
Current system-on-chip (SoC) camera designs face challenges in integrating multiple optical components efficiently, such as filters and lenses, which hinders the miniaturization and integration of various sensors like ambient light, color, and time-of-flight sensors within a single chip.
Innovation Solution
The SoC camera incorporates a sensor substrate with semiconductor material, including filter elements and a light sensor, connected to a semiconductor body with an integrated circuit, featuring a front dielectric layer with band-pass filters and metal spacers, along with a lens or array of lenses formed by semiconductor oxide, and a diffuser layer for improved optical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple optical components (filters, lenses) are integrated into the sensor substrate, then optical performance and sensor functionality are improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent combines multiple optical components (lenses, filters, diffusers) and sensor elements onto a single sensor substrate, creating an integrated system where previously separate components now coexist on one chip. This merging approach improves versatility while managing complexity through systematic integration
Solution Approach 2:
The sensor substrate is designed to perform multiple functions simultaneously - it serves as the base for sensor elements, supports optical components, provides electrical connections, and enables various sensing modalities (visible light, infrared, ambient light detection). This multi-functionality approach allows one component to fulfill multiple roles, improving adaptability without proportionally increasing complexity
2Adaptability or versatility
If multiple optical components are integrated into the sensor substrate, then various sensors can be combined in a single chip, but manufacturing precision requirements increase
Solution Approach 1:
The patent divides the sensor substrate into distinct functional regions - sensor element areas, optical component mounting areas, connection regions, and specialized zones for different sensor types. This segmentation allows each region to be optimized and manufactured separately with appropriate precision requirements, then integrated into the complete device
Solution Approach 2:
Different regions of the sensor substrate are designed with locally optimized properties - some areas have enhanced optical transmission, others have specific electrical characteristics, and certain zones are structured for mechanical support. This local quality approach ensures that manufacturing precision is applied where most critical rather than uniformly across the entire substrate
3Measurement precision
If filter elements and sensor elements are arranged in stacks at different distances, then wavelength-specific detection is improved, but device complexity increases
Solution Approach 1:
The patent arranges sensor elements and filter elements in vertical stacks at different distances from the sensor substrate surface, utilizing the third dimension (depth) to enable wavelength-specific detection. This vertical stacking approach allows multiple sensing functions to be packed into a compact footprint while maintaining optical performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the integration of optical components, reduces camera size, and facilitates the integration of multiple image sensors, enabling efficient light management and improved sensor performance across different wavelengths.
Implementation Method 1
Each of the filter elements may especially be a band-pass filter for either red, green or blue light
Implementation Method 2
a lens or an array of lenses is formed by an oxide of semiconductor material arranged on the surface of incidence
Implementation Method 3
a diffusor is formed above the light sensor by a modified region of the molding material
Implementation Method 4
sensor elements arranged in the sensor substrate according to an array of pixels
Data Source
AI summary
The system-on-chip camera comprises a semiconductor body with an integrated circuit, a sensor substrate, sensor elements arranged in the sensor substrate according to an array of pixels, a light sensor in the sensor substrate apart from the sensor elements, and a lens or an array of lenses on a surface of incidence. Filter elements, which may especially be interference filters for red, green or blue, are arranged between the sensor elements and the surface of incidence.