SOC Connection Plate Assembly for Uniform Current and Gas Sealing
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Solution Overview
Problem
Existing SOC stacks face challenges in achieving optimal performance by maximizing process gas utilization, electrical efficiency, and lifetime while minimizing parasitic loss, cost, and failure rate, with issues such as cell cracking during production and non-uniform current transfer between sub-stacks.
Innovation Solution
A thin connection plate made of electrically conducting material with axial gaskets and optional inner rings ensures uniform electrical contact and gas-tight sealing between sub-stacks and current collectors, allowing for easy assembly without additional sealing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional sealing methods are used between sub-stacks, then gas-tight sealing can be achieved, but assembly complexity increases and production time extends
Solution Approach 1:
The patent combines the sealing function and electrical connection function into a single integrated connection plate structure. The connection plate simultaneously provides gas-tight sealing through its peripheral sealing surface and electrical connection through conductive elements, eliminating the need for separate sealing components and simplifying assembly.
Solution Approach 2:
The connection plate serves multiple functions: it provides gas-tight sealing between sub-stacks, establishes electrical connection between cells, and maintains structural alignment. This multi-functional design reduces the total number of components needed in the stack assembly.
2Reliability
If multiple separate components are used for connection and sealing, then functional requirements are met, but the number of components increases and cost rises
Solution Approach 1:
The invention merges previously separate components (sealing elements, connection elements, and alignment features) into a single integrated connection plate, reducing the number of parts while maintaining all necessary functions for reliable sub-stack connection.
3Strength
If thick connection plates are used, then structural strength is improved, but thermal gradients increase and yield decreases
Solution Approach 1:
The patent optimizes the thickness parameter of the connection plate to achieve the minimum necessary value that still provides adequate structural strength. This parameter optimization reduces thermal mass and thermal gradients, improving yield while maintaining required mechanical properties.
4Ease of manufacture
If conventional assembly methods are used, then manufacturing simplicity is maintained, but production time increases and efficiency decreases
Solution Approach 1:
The connection plate is pre-designed with integrated sealing surfaces and connection features that enable direct assembly of sub-stacks without requiring additional sealing steps or complex alignment procedures during manufacturing, thereby reducing production time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances yield by reducing mechanical stress and thermal gradients, ensuring uniform current transfer and gas-tight connections, and minimizing production time and material waste.
Implementation Method 1
the thickness of said gasket zone during compression of the solid oxide cell stack is equal to the thickness of the connection plate
Implementation Method 2
the connection plate is enabled to provide uniform electrical connection across the solid oxide cell stack cross sectional area between two adjacent solid oxide cell sub-stacks
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
A Solid Oxide Cell stack has at least one connection plate between the solid oxide cell stack and an adjacent end plate, two adjacent end plates and/or between adjacent solid oxide cell sub-stacks.