Dynamic Feature Configuration for System-on-Chip Inventory Management
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Solution Overview
Problem
The challenge lies in efficiently configuring System-on-Chip (SoC) designs with varying feature sets without the need for physically distinct versions, which leads to inventory management issues for both chip suppliers and Original Equipment Manufacturers (OEMs, as they must forecast demand months in advance, risking manufacturing delays or excess inventory.
Innovation Solution
A method where an integrated circuit receives a feature vector message from an OEM, configures its features based on this message, generates an attestation result using a securely stored key known only to the supplier, and forwards this result, allowing for dynamic feature enabling or disabling during manufacturing without the need for multiple physical versions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If physically distinct SoC versions are created for different feature sets, then feature customization is achieved, but device complexity and inventory management complexity increase
Solution Approach 1:
The patent implements a universal SoC platform that can dynamically configure multiple feature sets through software control rather than requiring physically distinct hardware versions. The SoC includes a configuration mechanism that enables or disables features based on received configuration data, allowing a single physical device to serve multiple market segments and feature requirements.
Solution Approach 2:
The patent introduces dynamic feature configuration capability where the SoC can change its operational state by enabling or disabling features at runtime based on external configuration inputs. This dynamic reconfiguration allows the same hardware to adapt to different feature sets without physical modification, resolving the contradiction between customization and complexity.
2Ease of manufacture
If feature configuration is done during chip manufacture, then feature sets are fixed, but inventory forecasting accuracy decreases
Solution Approach 1:
The patent enables preliminary configuration preparation where configuration data can be prepared and validated in advance without committing to physical manufacturing decisions. The configuration mechanism allows OEMs to specify feature sets closer to deployment time, reducing forecasting uncertainty while maintaining manufacturing efficiency through standardized configuration interfaces.
3Adaptability or versatility
If multiple physical SoC versions are manufactured, then feature diversity is provided, but production cost increases
Solution Approach 1:
The patent creates a universal manufacturing process that produces a single SoC platform capable of supporting multiple feature sets through software configuration rather than requiring separate production lines for each feature variant. This approach consolidates manufacturing operations, reduces tooling costs, and eliminates the need for maintaining multiple fabrication lanes.
Solution Approach 2:
The patent merges multiple feature set implementations into a single physical SoC design by integrating a configuration mechanism that enables dynamic feature activation. This consolidation combines what would traditionally require separate hardware versions into one unified platform, reducing production complexity and cost.
Data Source
AI summary
A method for configuring the features of an integrated circuit. In the method, the integrated circuit receives a feature vector message from a first party. The feature vector message is included in a response to a feature set request from the first party to a second party. The integrated circuit configures at least one feature of the integrated circuit based on a feature vector in the feature vector message. The integrated circuit generates an attestation result based on the at least one configured feature of the integrated circuit and using a key securely stored in the integrated circuit and known to the second party and not known to the first party. The integrated circuit forwards the attestation result to the first party.