Integrated SOC Interconnect-Spacer for Precise Layer Alignment
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Solution Overview
Problem
Existing Solid Oxide Cell (SOC) stacks face challenges in optimizing process gas utilization, reducing parasitic loss, enhancing electrical efficiency, extending lifetime, minimizing cost and production time, and reducing the number of components and material waste, while addressing issues like edge re-oxidation and misalignment during assembly.
Innovation Solution
An integrated interconnect and spacer made from a single sheet of metal, where the spacer is folded onto the interconnect, eliminating separate components, reducing material waste, and incorporating oxy channels within the interconnect-spacer assembly to prevent edge re-oxidation, with a contact enabling layer fixed using folding or indentations to ensure precise alignment without adhesives or welding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If separate interconnect and spacer components are used, then assembly flexibility is improved, but the number of components increases and production time increases
Solution Approach 1:
The patent combines the interconnect and spacer into a single integrated component made from one piece of plate. The spacer is formed by bending edges of the interconnect plate 180° multiple times, eliminating the need for separate spacer components and reducing the total number of parts in the SOC stack.
Solution Approach 2:
The integrated interconnect-spacer component performs multiple functions simultaneously: it provides electrical connection between cells, acts as a gas barrier, provides structural support, and serves as a spacer to maintain cell spacing. This multi-functional design reduces component count while maintaining assembly flexibility.
2Manufacturing precision
If separate interconnect and spacer components are used, then manufacturing precision can be optimized independently, but material waste increases and production time increases
Solution Approach 1:
The interconnect and spacer are manufactured as a single integrated component from one piece of plate through bending operations. This eliminates the need for separate manufacturing processes and material cutting for spacers, significantly reducing material waste while maintaining manufacturing precision through controlled bending operations.
3Adaptability or versatility
If multiple separate components are used, then functional optimization is improved, but sealing areas increase and reliability decreases
Solution Approach 1:
By integrating the spacer and interconnect into one component, the number of sealing interfaces is reduced. The bent edges of the integrated component provide sealing surfaces that eliminate the need for additional sealing between separate interconnect and spacer parts, improving sealing reliability and reducing potential failure points.
4Strength
If contact enabling layer is fixed using adhesives or welding, then fixation strength is improved, but manufacturing complexity increases and production time increases
Solution Approach 1:
The integrated interconnect-spacer component provides self-alignment and self-fixation features through its geometry. The bent edges and integrated structure enable the contact enabling layer to be positioned and secured without requiring additional adhesives or welding operations, simplifying manufacturing while maintaining fixation strength.
Data Source
AI summary
A Solid Oxide Cell stack has an integrated interconnect and spacer. which is formed by bending a surplus part of the plate interconnect 180° to form a spacer part on top of the interconnect and connected to the interconnect at least by the bend and also providing a fixture for a contact enabling layer which is located on at least one side of the integrated interconnect and spacer.