SoC Memory Thermal Prediction via Command Analysis
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Solution Overview
Problem
Existing memory devices lack proactive measures to predict and mitigate future thermal events, relying on reactive thermal throttling that is dependent on insufficient thermal sensor sampling rates.
Innovation Solution
The implementation of preconfigured thermal models in a System-on-Chip (SoC) device allows for the prediction of future thermal events, enabling proactive adjustments such as deferring writes or throttling operations to maintain optimal thermal operating conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If reactive thermal throttling is used, then thermal events are addressed after occurrence, but thermal sensor sampling rates are insufficient for timely detection
Solution Approach 1:
The patent applies preliminary action by using thermal models to predict future thermal events before they occur. The memory controller continuously monitors command sequences and uses pre-configured thermal models to forecast temperature changes, allowing the system to take preventive measures (such as throttling operations or deferring writes) before thermal constraints are actually violated. This eliminates the need for high-speed thermal sensors by performing the thermal management action in advance based on workload analysis.
2Reliability
If thermal models are implemented for prediction, then proactive thermal management is achieved, but device complexity increases
Solution Approach 1:
The patent applies parameter changes by utilizing pre-configured thermal models with different characteristics (e.g., conservative vs. aggressive thermal profiles) that can be selected based on operational conditions. The system changes parameters such as thermal constraints, prediction time horizons, and mitigation strategies dynamically based on the command sequence analysis and current operational state, allowing flexible thermal management without requiring complex real-time computation.
3Temperature
If proactive adjustments are made to prevent thermal events, then thermal operating conditions are maintained, but operational productivity decreases
Solution Approach 1:
The patent applies partial action by implementing selective throttling only for specific command sequences or memory operations that are predicted to cause thermal issues. Rather than uniformly reducing all operations, the system identifies and targets only the problematic operations for throttling or deferral, allowing non-problematic operations to proceed at full speed. This minimizes the impact on overall productivity while still achieving thermal management goals.
Data Source
AI summary
The present disclosure includes apparatuses and methods related to receiving, by a System-on-Chip (SoC) device, a command sequence and predicting a thermal event that likely corresponds to the received command sequence. The command sequence may include an instruction code that can be representative of a mode of operation of a vehicle. In one embodiment, a thermal model may be used to predict the likely thermal event that corresponds to the command sequence. A thermal option may then be implemented to address adverse thermal effects of the predicted thermal event.