Semiconductor Package Assembly Heat Spreader Thermal Management
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Solution Overview
Problem
High band package on package (HBPOP) semiconductor assemblies face challenges with thermal dissipation and package height reduction.
Innovation Solution
A semiconductor package assembly comprising a system-on-chip (SOC) package, a memory package, and a heat spreader, where the heat spreader is positioned between the SOC and memory packages to enhance heat dissipation, and an underfill is used to fill the gap between them, eliminating the need for an interposer for electrical connections, thereby reducing the package height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat spreader is added between SOC and memory packages to improve heat dissipation, then thermal performance is improved, but device complexity increases
Solution Approach 1:
The heat spreader is integrated into the package assembly structure and serves dual purposes: dissipating heat from the logic die and providing mechanical support between the SOC and memory packages. This merging of thermal management and structural support functions reduces the need for additional separate components, thereby improving thermal performance while limiting the increase in device complexity.
2Productivity
If package height is reduced to meet miniaturization requirements, then productivity is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The heat spreader is positioned horizontally between the SOC and memory packages, creating a thermal management layer in the vertical dimension. This allows effective heat dissipation path to be established without increasing the overall package height significantly, as the heat spreader's thermal conduction occurs in the horizontal plane while its thickness in the vertical direction remains minimal.
Solution Approach 2:
The heat spreader is strategically positioned only in the regions where heat generation is highest (adjacent to the logic die), rather than uniformly distributed throughout the entire package. This localized approach provides effective heat dissipation capability where most needed while minimizing the impact on package height and overall device dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves thermal performance by reducing thermal resistance and enhances heat dissipation capabilities while minimizing the package height, addressing the limitations of existing HBPOP assemblies.
Implementation Method 1
the heat spreader is in contact with a back surface of the logic die away from the pads
Data Source
AI summary
A semiconductor assembly package is provided. The semiconductor package assembly includes a system-on-chip (SOC) package, a memory package and a heat spreader. The SOC package includes a logic die and a first substrate. The logic die has pads on it. The first substrate is electrically connected to the logic die by the pads. The memory package includes a second substrate and a memory die. The second substrate has a top surface and a bottom surface. The memory die is mounted on the top surface of the second substrate and is electrically connected to the second substrate using bonding wires. The heat spreader is disposed between the SOC package and the memory package, wherein the heat spreader is in contact with a back surface of the logic die away from the pads.