SoC Power Estimation via RC Thermal Modeling
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Solution Overview
Problem
In systems on chip (SoC), power consumption of certain nodes is not directly measured, leading to inaccurate power consumption measurements for the entire system, as heat generated by one element can be transferred to nearby elements, complicating the estimation of power consumption.
Innovation Solution
An integrated circuit with a power estimation manager circuit that uses resistive-capacitive (RC) thermal modeling data, power data, and temperature data to estimate power consumption of a node at a later time point, correcting power data of other nodes based on the estimated power consumption, and incorporating temperature sensors to measure temperatures at different time points.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If power consumption is measured directly for all nodes, then measurement precision is improved, but device complexity increases due to the need for multiple measurement circuits
Solution Approach 1:
The patent introduces temperature as an intermediary parameter to indirectly measure power consumption. Instead of directly measuring power for each node, temperature sensors measure the thermal state of nodes, and the power estimation circuit uses RC thermal modeling to convert temperature data into power consumption estimates. This intermediary approach allows accurate power measurement without adding complex power sensing circuits to each node.
Solution Approach 2:
The patent replaces direct electrical power measurement systems with a thermal-based measurement system. By substituting electrical measurement circuits with temperature sensors and thermal modeling algorithms, the system achieves power consumption measurement with reduced hardware complexity. The RC thermal model acts as a computational substitute for direct electrical measurement.
2Device complexity
If temperature measurement is used to estimate power consumption, then device complexity is reduced, but measurement precision deteriorates due to heat transfer between nearby elements
Solution Approach 1:
The patent segments the thermal measurement system by introducing multiple temperature sensors at different locations and using RC thermal modeling to distinguish heat sources. Instead of treating the chip as a single thermal zone, the system divides it into multiple thermal nodes, each with its own temperature measurement and thermal model parameters. This segmentation allows the system to account for heat transfer between elements and accurately attribute temperature changes to specific power-consuming nodes.
Solution Approach 2:
The patent implements a feedback mechanism where the power estimation circuit continuously monitors temperature data, compares it with RC thermal model predictions, and iteratively refines power consumption estimates. The system uses the relationship between estimated power, temperature change, and thermal modeling data in a closed-loop fashion to improve measurement accuracy over time, compensating for heat transfer effects between nearby elements.
3Measurement precision
If RC thermal modeling data is used to correct power data of second nodes, then measurement precision is improved, but loss of time increases due to additional processing
Solution Approach 1:
The patent applies preliminary action by pre-calculating and storing RC thermal modeling data before runtime power estimation. The thermal models, including resistance and capacitance values for different nodes and their interconnections, are computed in advance and stored in memory. During operation, the power estimation circuit only needs to retrieve these pre-computed models and combine them with current temperature measurements, significantly reducing real-time processing requirements while maintaining high measurement precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for accurate estimation of power consumption of nodes whose power consumption is not directly measured, improving the accuracy of overall power consumption determination in SoC systems and enabling effective power management.
Implementation Method 1
at least one of the temperature sensors is used to measure temperatures of the first node at the first and second time points
Implementation Method 2
a storage circuit that includes a first region storing resistive-capacitive (RC) thermal modeling data
Implementation Method 3
heat generated by one of the elements may be transferred to at least one other nearby element
Data Source
AI summary
A power estimation circuit including: a power estimation manager circuit configured to receive power data and temperature data; and a storage circuit that includes a first region storing resistive-capacitive (RC) thermal modeling data, a second region storing the power data and a third region storing the temperature data, wherein the power estimation manager circuit is configured to estimate power consumption of a first node at a second time point, which occurs after a first time point, using the RC thermal modeling data, the power data and the temperature data.