Socket With Angled Air Ducts For Optical Transceiver Cooling
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Solution Overview
Problem
Optical transceivers in opto-electronic assemblies are sensitive to heat, and existing temperature control methods do not effectively manage heat dissipation, leading to reduced performance and shorter lifetimes due to high temperatures generated by processor chips.
Innovation Solution
A socket with air ducts and airflow management features is used to position optical components in a lower temperature airflow area, allowing for enhanced heat dissipation and increased airflow around processor chips, enabling the use of high-power processor chips while minimizing obstructions to airflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If optical transceivers are integrated with processor chips in a single package, then device integration and compactness are improved, but heat dissipation deteriorates due to high temperatures generated by processor chips affecting sensitive optical components
Solution Approach 1:
The patent divides the assembly into distinct thermal zones by positioning optical transceivers away from the processor chip heat source. The socket structure creates separate regions: a first region for the processor chip and a second region for optical transceivers, allowing independent thermal management for each component type
Solution Approach 2:
The patent introduces an intermediary cooling structure (heat sink with airflow path) between the processor chip and optical transceivers. This intermediary component captures heat from the processor chip and directs it away from the optical transceivers through controlled airflow paths, preventing direct thermal coupling
2Temperature
If heat sinks are used for temperature control, then heat dissipation is improved, but airflow obstruction increases due to physical blocks in airflow paths
Solution Approach 1:
The patent applies different structural qualities to different regions: the socket has open walls in regions requiring airflow for cooling, while providing structural support and enclosure in other regions. This allows localized optimization where airflow is needed versus where structural integrity is needed
Solution Approach 2:
Instead of using solid heat sinks that block airflow, the patent inverts the approach by using open-wall socket structures that permit airflow while still providing thermal management through positioned heat dissipation components that do not obstruct the primary airflow paths
3Volume of moving object
If optical components are positioned close to processor chips, then device compactness is improved, but performance deteriorates due to high temperature exposure affecting sensitive optical operations
Solution Approach 1:
The patent positions optical transceivers in a different spatial dimension relative to the processor chip - specifically, on opposite sides of the socket structure. This three-dimensional arrangement maintains compact overall device volume while creating sufficient thermal separation to protect optical components from processor chip heat
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution extends the useful life of optical components by maintaining them in a lower temperature environment, improving their performance and allowing for the integration of high-power processor chips without obstructing airflow, thus enhancing heat removal and overall assembly efficiency.
Implementation Method 1
a plurality of walls extending from the base section that are angled with respect to the base section, wherein the plurality of walls include air ducts to enable air to flow through a socket
Data Source
AI summary
According to an example, a socket to support a first board in a spaced relation to a second board may include a base section having openings to receive connectors that are to electrically connect the first board to the second board. The socket may also include a plurality of walls extending from the base section, in which each of the plurality of walls is angled with respect to the base section and in which the plurality of walls include air ducts to enable air to flow through the socket when the first board is positioned on the socket. The socket may further include socket alignment elements extending from the base section, in which the alignment elements are to be inserted into mating holes in the second board.