Socket Assembly Power Routing Segmentation
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Solution Overview
Problem
Conventional socket assemblies face challenges in meeting signal and power output requirements for electronic packages due to a large footprint and reduced signal performance caused by routing signal lines near power lines, necessitating a smaller size with more conductors while maintaining electrical performance.
Innovation Solution
A socket assembly design that includes a socket connector with a socket substrate and power connector, where the power connector is directly connected to the electronic package independent of the host circuit board, reducing the number of power circuits needed between the socket connector and the host circuit board, allowing more circuits for data signal paths and ground paths, enhancing data transfer and reducing the footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If power circuits and signal lines are routed through the socket substrate, then electrical connection is achieved, but signal performance is reduced due to proximity to power lines
Solution Approach 1:
The patent segments the electrical connection paths by separating power circuit routing from signal line routing. Power circuits are routed through dedicated power contacts and power circuits on the socket substrate, while signal lines use separate signal contacts and signal circuits. This segmentation prevents interference between power and signal paths, improving signal performance while maintaining manageable routing complexity.
2Reliability
If more conductors are added to meet power and signal requirements, then electrical performance is improved, but footprint increases
Solution Approach 1:
The patent merges multiple functions into integrated connector assemblies. The socket connector includes both signal contacts and power contacts integrated into a single substrate structure. The host circuit board connector similarly integrates multiple signal circuits and power circuits. This merging reduces the overall footprint by eliminating separate dedicated connectors for power and signals, while still providing the necessary number of conductors for high-performance electrical connections.
3Power
If power circuits are routed on the host circuit board, then power delivery is achieved, but board space is occupied
Solution Approach 1:
The patent extracts power circuit routing from the host circuit board by implementing dedicated power contacts on the socket substrate that connect directly to power delivery networks. The power circuits are routed through the socket substrate itself rather than occupying space on the host circuit board. This extraction reduces the board space required for power delivery while maintaining adequate power delivery capability through the specialized socket substrate routing.
Data Source
AI summary
A socket assembly includes a socket connector including a socket substrate having an upper surface and a lower surface, upper socket contacts on the upper surface configured to be terminated to an electronic package and lower socket contacts configured to be terminated to a host circuit board. The socket connector includes first and second power contacts. The first power contact is configured to be terminated to the electronic package. The socket assembly includes a power connector terminated to the socket substrate having a power connector terminal electrically connected to the second power contact. The socket substrate is configured to electrically connect the power connector to the electronic package through the first power contact and the second power contact.