Socket Assembly Thermal Management Structure
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Solution Overview
Problem
Existing solid-state lighting systems face challenges with thermal management, including inefficient heat transfer and cumbersome replacement processes for LEDs or PCBs, which require skilled labor and can result in the entire PCB needing replacement if one LED malfunctions.
Innovation Solution
A socket assembly with a removable lighting package and integrated thermal management structure that engages a heat sink, allowing for efficient heat dissipation and easy replacement of lighting components without the need for additional thermal interfaces like grease or epoxy, featuring a socket housing with a receptacle and heat dissipating structure that can be mounted as a unit to the heat sink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If LEDs are soldered down to a PCB and mechanically attached to a heat sink with thermal grease or epoxy, then thermal transfer can be achieved, but the thermal interface products are difficult to work with and do not provide sufficient heat transfer
Solution Approach 1:
The invention extracts and eliminates the thermal interface product (thermal grease, thermal pad, or thermal epoxy) from the system by providing a lighting package with an integrated heat dissipating structure that directly engages the heat sink, removing the need for separate thermal interface materials while maintaining effective heat transfer
Solution Approach 2:
The invention merges the lighting package with an integrated heat dissipating structure, combining the LED mounting function and thermal management function into a single unified component that directly interfaces with the heat sink
2Reliability
If LEDs are soldered to a PCB that is mechanically attached to a heat sink, then the lighting system can be assembled, but the rework process is tedious and requires skilled labor when LEDs or PCB needs to be replaced
Solution Approach 1:
The invention segments the lighting system into a removable lighting package that can be independently replaced, separating the LED module with its integrated heat dissipating structure from the permanent heat sink and socket housing, enabling easy replacement without affecting the entire PCB or heat sink assembly
Solution Approach 2:
The invention introduces dynamic replaceability to the lighting system by designing the lighting package with removable electrical and thermal connections, allowing the lighting package to be easily inserted and removed from the socket housing without permanent attachment
3Adaptability or versatility
If the PCB includes many LEDs and is mechanically attached to a heat sink, then the lighting system can be configured, but if one LED malfunctions, the entire PCB may need to be replaced
Solution Approach 1:
The invention segments the lighting system into individual replaceable lighting packages, each containing LEDs with their own integrated heat dissipating structures, allowing replacement of individual lighting packages rather than entire PCBs when LEDs malfunction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances thermal management efficiency, simplifies the replacement process, and allows for modular configuration of lighting systems, reducing the need for skilled labor and minimizing downtime during maintenance or upgrades.
Implementation Method 1
A heat dissipating structure is coupled to the socket housing and is positioned at the receptacle in thermal engagement with the lighting package. The heat dissipating structure is configured to engage a heat sink to dissipate heat from the lighting package to the heat sink.
Data Source
Figure 1~2
Figure 3
Figure 4~5
AI summary
A socket assembly (100) includes a lighting package (102) and a socket housing (106) having a receptacle (104) that removably receives the lighting package (102). A thermal management structure (108) is coupled to the socket housing (106) and is positioned at the receptacle (104) in thermal engagement with the lighting package (102). The thermal management structure (108) is configured to engage a heat sink (110) to dissipate heat from the lighting package (102) to the heat sink (110). Optionally, at least one of the socket housing (106) and the thermal management structure (108) may have mounting features (142) configured to mount the socket assembly (106) to a heat sink (110), where the lighting package (102) is removable from the receptacle (104) while the socket assembly (106) remains mounted to the heat sink (110). The thermal management structure (108) may be coupled to the socket housing (106) such that the thermal management structure (108) and the socket housing (106) are coupled to a heat sink (110) as a unit.