Socket Capacitor Placement for Low-Impedance PCB Power Delivery

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing methods for placing capacitors in power distribution networks (PDN) on printed circuit boards (PCB) fail to effectively reduce impedance and power supply ripple, particularly when capacitors are located on the bottom of the socket, which adds inductance and negates the benefits of their presence.

Innovation Solution

Placing capacitors on the top of the pin array on the PCB to decouple the PDN, reducing loop inductance and improving frequency range performance by eliminating spring-pin inductance from the transmission line.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If capacitors are placed on the bottom of the socket, then they can be easily installed on the PCB, but the spring-pin inductance is added to the inductances which significantly reduces the benefit of having capacitors on the socket

Engineering Contradiction:

Improveease of capacitor installationVSAvoidpower supply stability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent inverts the conventional capacitor placement location from the bottom of the socket to the top surface. This inversion eliminates the spring-pin inductance from the transmission line by placing capacitors directly on the top surface of the socket, achieving lower impedance and better power supply stability while maintaining ease of installation through standard PCB mounting techniques

Inventive Principle:

Principle #13The other way round (Inversion)

2Reliability

If capacitors are placed on the top of the pin array, then the loop inductance is reduced and power supply ripple is decreased, but the first area and second area must not overlap requiring more PCB space

Engineering Contradiction:

Improvepower supply stabilityVSAvoidPCB space

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent applies local quality by designating specific zones on the PCB: a first area for electrical connections (plated through holes with spring pins) and a second area for capacitors. By ensuring these areas do not overlap and are locally optimized for their respective functions, the design achieves low inductance while managing space requirements through targeted functional zoning

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in a significant reduction of power supply ripple, achieving a 65% improvement in the critical frequency range of 5 MHz to 500 MHz by minimizing impedance and enhancing the PDN's performance.

Implementation Method 1

The present invention provides and places capacitors on the printed circuit board (PCB) of the structure to decouple the PDN and result in lower impedance benefitting the frequency range of the PDN

Methodology Applied

Scientific EffectCapacitance: Capacitance

Implementation Method 2

This reduction in impedance results in a reduction of the power supply ripple. The reduced loop inductance of having the capacitor on the top side provides for a much better result

Methodology Applied

Scientific EffectInductance reduction: Electrical Resistance

Data Source

PatentUS12506304B2Capacitor in socket

Publication Date: 2025.12.23 R&D CIRCUITS INC

AI summary

An improved method and structure for forming an electrical interconnects mechanism in a Power Distribution Network (PDN) by placing capacitors on the top of the pin array on the printed circuit board (PCB) of the structure to decouple the PDN and results in lower impedance benefitting the frequency range of the PDN effecting a significant performance improvement in the spring-pin inductance from the transmission line. This reduction in impedance reduces the power supply ripple.