Socket Connector Cooling Channels for High-Current Contacts
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Solution Overview
Problem
Existing electrical interconnects face limitations in current transmission capacity, leading to increased temperature and potential failure when transmitting power, due to the size and material properties of the contacts, which restricts the current carrying ability and requires larger sizes or more contacts to avoid damage.
Innovation Solution
The implementation of a socket connector system with compressible socket contacts and integrated coolant channels that enhance cooling, allowing for increased current transmission by reducing operating temperatures through convection cooling, thereby improving the current carrying capacity without increasing the overall size or number of contacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the contact size is increased to improve current carrying ability, then the current transmission capacity is improved, but the mechanical and signal integrity deteriorates
Solution Approach 1:
The patent changes the thermal parameter of the system by introducing active cooling through coolant channels, which allows the contact to operate at lower temperatures even when transmitting high current. This parameter change (temperature control) enables the contact to maintain both high current carrying ability and good mechanical/signal integrity by preventing thermal degradation.
2Quantity of substance
If the number of contacts is increased to improve total current transmission, then the current transmission capacity is improved, but the overall size of the electrical interconnect increases
Solution Approach 1:
The patent changes the operational parameter of the contact by implementing active thermal management through coolant channels. This allows a single contact to transmit higher current by maintaining lower operating temperatures, thereby achieving increased total current transmission without increasing the number of contacts or overall interconnect size.
Solution Approach 2:
The patent replaces the passive mechanical approach (increasing contact size or number to handle more current) with an active thermal management system using coolant channels. This substitution allows the same physical contact to handle higher currents by actively removing heat, thus avoiding the need to increase the mechanical dimensions or quantity of contacts.
3Power
If the current transmitted through the contact is increased to improve power transmission, then the power transmission capacity is improved, but the temperature of the contact increases leading to stress relaxation and contact resistance increase
Solution Approach 1:
The patent actively changes the temperature parameter of the contact by introducing coolant channels that flow through or alongside the contact. This allows the contact to transmit higher power (current) while maintaining lower operating temperatures, preventing stress relaxation and contact resistance increase that would otherwise occur at elevated temperatures.
Solution Approach 2:
The patent converts the harmful effect of heat generation during high current transmission into a beneficial controlled thermal management system. By intentionally introducing coolant channels, the heat that would normally be a harmful byproduct of high power transmission is instead managed and dissipated, enabling sustained high current transmission without thermal degradation.
4Power
If the current transmitted through the contact is increased to improve power transmission, then the power transmission capacity is improved, but the plastic housing becomes soft and loses dimensional stability
Solution Approach 1:
The patent changes the thermal parameter of the entire assembly by implementing coolant channels that cool not only the contact but also the surrounding plastic housing. This active cooling prevents the housing from becoming soft and losing dimensional stability, even when high current is transmitted through the contact, thereby maintaining structural integrity during high power transmission.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of coolant channels within the socket connector system effectively reduces the operating temperature of the contacts, enabling higher current transmission while maintaining mechanical and signal integrity, thus addressing the limitations of existing interconnects and enhancing reliability.
Implementation Method 1
The socket housing includes coolant channels configured to receive coolant... effectively reduces the operating temperature of the contacts, enabling higher current transmission
Implementation Method 2
Each socket contact has an upper contact portion and a lower contact portion. The lower contact portion is electrically connected to the corresponding board contact of the host circuit board... The package contacts are electrically connected to the upper contact portions of the socket contacts
Implementation Method 3
The socket contact is compressible between the upper contact portion and the lower contact portion
Data Source
AI summary
An electronic assembly is provided and includes a host circuit board having an upper surface and board contacts on the upper surface. The upper surface has a mounting area. The electronic assembly includes a socket connector mounted to the host circuit board at the mounting area. The socket connector includes a socket housing holding a plurality of socket contacts. Each socket contact has an upper contact portion and a lower contact portion. The lower contact portion is electrically connected to the corresponding board contact of the host circuit board. The socket contact is compressible between the upper contact portion and the lower contact portion. The socket housing includes coolant channels configured to receive coolant. The electronic assembly includes an electronic package coupled to the socket connector. The electronic package has a lower surface and package contacts on the lower surface. The package contacts are electrically connected to the upper contact portions of the socket contacts.